SN74AUP1G06_10 Datasheet, PDF (9/21 Pages) Texas Instruments – LOW-POWER SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS

PACKAGE OPTION ADDENDUM
www.ti.com
27-Apr-2010
PACKAGING INFORMATION
Orderable Device
SN74AUP1G06DBVR
SN74AUP1G06DBVRE4
SN74AUP1G06DBVRG4
SN74AUP1G06DBVT
SN74AUP1G06DBVTE4
SN74AUP1G06DBVTG4
SN74AUP1G06DCKR
SN74AUP1G06DCKRE4
SN74AUP1G06DCKRG4
SN74AUP1G06DCKT
SN74AUP1G06DCKTE4
SN74AUP1G06DCKTG4
SN74AUP1G06DRLR
SN74AUP1G06DRLRG4
SN74AUP1G06DRYR
SN74AUP1G06DSFR
SN74AUP1G06YFPR
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
SOT-23
Package
Drawing
DBV
SOT-23
DBV
SOT-23
DBV
SOT-23
DBV
SOT-23
DBV
SOT-23
DBV
SC70
DCK
SC70
DCK
SC70
DCK
SC70
DCK
SC70
DCK
SC70
DCK
SOT
DRL
SOT
DRL
SON
DRY
SON
DSF
DSBGA
YFP
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
5 3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5 3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5 3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5 3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5 3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5 3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5 4000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
5 4000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
6 5000 Green (RoHS & NIPDAU Level-1-260C-UNLIM
no Sb/Br)
6 5000 Green (RoHS & NIPDAU Level-1-260C-UNLIM
no Sb/Br)
4 3000 Green (RoHS & SNAGCU Level-1-260C-UNLIM
no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
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