DRV10963 Datasheet, PDF (9/14 Pages) Texas Instruments – 5-V, THREE PHASE, SENSORLESS BLDC MOTOR DRIVER

DRV10963
www.ti.com
SLAS955 – MARCH 2013
UNDER VOLTAGE PROTECTION
The DRV10963 contains an under voltage lockout feature, which prevents motor operation below a specified
voltage. Upon power up, the DRV10963 will operate once V_CC rises above V_{UVLO_H}. The DRV10963 will continue
to operate until V_CC falls below V_{UVLO_L}.
PIN
VCC
FG
Table 4. Recommended Component Values
TO
GND
Voltage ≤ V_CC
FUNCTION
Decoupling Capacitor
Pull up resistor for Open Drain output
VALUE
2.2 µF, 10 V, X5R
100 kΩ
PCB Thermal Layout Considerations
The package uses an exposed pad to remove heat from the device. For proper operation, this pad must be
thermally connected to copper on the PCB to dissipate heat. On a multi-layer PCB with a ground plane, this can
be accomplished by adding a number of vias to connect the thermal pad to the ground plane. On PCBs without
internal planes, copper area can be added on either side of the PCB to dissipate heat. If the copper area is on
the opposite side of the PCB from the device, thermal vias are used to transfer the heat between top and bottom
layers.
For details about how to design the PCB, refer to TI application report SLMA002, " PowerPAD™ Thermally
Enhanced Package" and TI application brief SLMA004, " PowerPAD™ Made Easy", available at www.ti.com. In
general, the more copper area that can be provided, the more power can be dissipated.
Copyright © 2013, Texas Instruments Incorporated
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