TLC5602C_15 Datasheet, PDF (8/14 Pages) Texas Instruments – VIDEO 8-BIT DIGITAL-TO-ANALOG CONVERTERS

TLC5602C, TLC5602M
VIDEO 8-BIT DIGITAL-TO-ANALOG CONVERTERS
SLAS023D – FEBRUARY 1989 – REVISED JANUARY 2002
APPLICATION INFORMATION
The following design recommendations benefit the TLC5602 user:
D Physically separate and shield external analog and digital circuitry as much as possible to reduce system
noise.
D Use RF breadboarding or RF printed-circuit-board (PCB) techniques throughout the evaluation and
production process.
D Since ANLG GND and DGTL GND are not connected internally, these terminals need to be connected
externally. With breadboards, these ground lines should connect to the power-supply ground through
separate leads with proper supply bypassing. A good method is to use a separate twisted pair for the analog
and digital supply lines to minimize noise pickup.
Use wide ground leads or a ground plane on the PCB layouts to minimize parasitic inductance and
resistance. The ground plane is the better choice for noise reduction.
D ANLG V_DD and DGTL V_DD are also separated internally, so they must connect externally. These external
PCB leads should also be made as wide as possible. Place a ferrite bead or equivalent inductance in series
with ANLG V_DD and the decoupling capacitor as close to the device terminals as possible before the ANLG
V_DD and DGTL V_DD leads are connected together on the board.
D Decouple ANLG V_DD to ANLG GND and DGTL V_DD to DGTL GND with a 1-µF and 0.01-µF capacitor,
respectively, as close as possible to the appropriate device terminals. A ceramic chip capacitor is
recommended for the 0.01-µF capacitor.
D Connect the phase compensation capacitor between COMP and ANLG GND with as short a lead-in as
possible.
D The no-connection (NC) terminals on the small-outline package should be connected to ANLG GND.
D Shield ANLG V_DD, ANLG GND, and A OUT from the high-frequency terminals CLK and D7 – D0. Place
ANLG GND traces on both sides of the A OUT trace on the PCB.
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