SMJ320C30KGDB Datasheet, PDF (8/9 Pages) Texas Instruments – FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIE

SMJ320C30KGDB
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIE
SGUS019B – NOVEMBER 1995 – REVISED DECEMBER 1998
Table 1. ’320C30KGD Die Pad Information : rev 7.4 (0,72 µm) (Continued)
’C30 DIE BOND PAD
LOCATIONS
155
156
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189
190
191
192
193
194
195
196
197
198
199
200
201
202
203
204
DIE/TAB BOND PAD
IDENTITY
DVSS
VSSL
IVSS
CVSS
X2/CLKIN
X1
VSUBS
EMU5
IORDY
MSTRB
IOSTRB
IOR/W
HOLDA
HOLD
MDVDD
MDVDD
RDY
STRB
R/W
RESET
XF1
XF0
IACK
INT0
VDDL
VDDL
VSSL
IVSS
INT1
INT2
INT3
RSV0
RSV1
RSV2
RSV3
RSV4
RSV5
RSV6
RSV7
RSV8
RSV9
RSV10
DR1
FSR1
CLKR1
CLKX1
FSX1
DX1
CVSS
DVSS
DIE SIDE #4
X-COORDINATE OF
THE DIE BOND PAD
8167.43
8020.73
7877.63
7742.63
7582.07
7412.51
7176.53
6404.15
6245.93
6087.71
5952.71
5817.71
5682.71
5524.49
5366.27
5231.27
5073.05
4914.83
4779.83
4621.61
4463.39
4328.39
4193.39
4035.17
3876.95
3741.95
3602.27
3458.09
3297.53
3124.55
2943.11
2770.49
2597.87
2425.25
2252.63
2080.01
1914.59
1779.59
1644.84
1509.84
1374.84
1239.84
1104.84
969.84
654.84
498.24
341.64
185.04
28.44
–128.16
Y-COORDINATE OF
THE DIE BOND PAD
7558.83
PITCH OF LEAD
146.70
143.10
135.00
160.56
169.56
235.98
772.38
158.22
158.22
135.00
135.00
135.00
158.22
158.22
135.00
158.22
158.22
135.00
158.22
158.22
135.00
135.00
158.22
158.22
135.00
139.68
144.18
160.56
172.98
181.44
172.62
172.62
172.62
172.62
172.62
165.42
135.00
134.75
135.00
135.00
135.00
135.00
135.00
315.00
156.60
156.60
156.60
156.60
156.60
8
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