SMJ320C30KGDB Datasheet, PDF (6/9 Pages) Texas Instruments – FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIE

SMJ320C30KGDB
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIE
SGUS019B – NOVEMBER 1995 – REVISED DECEMBER 1998
Table 1. ’320C30KGD Die Pad Information : rev 7.4 (0,72 µm) (Continued)
’C30 DIE BOND PAD
LOCATIONS
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
DIE/TAB BOND PAD
IDENTITY
DVSS
VSSL
IVSS
CVSS
IOD31
A23
A22
A21
A20
A19
A18
A17
A16
A15
A14
ADVDD
ADVDD
A13
A12
A11
A10
A9
A8
A7
A6
VDDL
VDDL
DVSS
CVSS
A5
A4
A3
A2
A1
A0
EMU0
EMU1
EMU2
EMU3
EMU4
MC / MP
IOA12
IOA11
IOA10
IOA9
IOA8
IOA7
IOA6
CVSS
IVSS
VSSL
DVSS
DIE SIDE #2
X-COORDINATE OF
THE DIE BOND PAD
0.00
139.68
274.68
409.68
609.48
773.28
944.28
1093.68
1343.88
1478.88
1613.88
1784.63
1919.63
2054.63
2225.63
2360.63
2495.63
2688.23
2837.63
2987.03
3136.43
3285.83
3435.23
3599.03
3734.03
3897.83
4032.83
4177.37
4321.91
4480.85
4637.63
4794.23
4950.83
5107.43
5264.03
5443.85
5646.89
5849.93
6029.75
6209.57
6412.61
6570.83
6720.23
6869.63
7019.03
7168.43
7317.83
7467.23
7710.23
7859.63
8009.03
8158.79
Y-COORDINATE OF
THE DIE BOND PAD
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.18
0.18
0.18
0.18
0.18
0.18
0.18
0.18
0.18
0.18
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
0.00
PITCH OF LEAD
139.68
135.00
135.00
199.80
163.80
171.00
149.40
250.20
135.00
135.00
170.75
135.00
135.00
171.00
135.00
135.00
192.60
149.40
149.40
149.40
149.40
149.40
163.80
135.00
163.80
135.00
144.54
144.54
158.94
156.78
156.60
156.60
156.60
156.60
179.82
203.04
203.04
179.82
179.82
203.04
158.22
149.40
149.40
149.40
149.40
149.40
149.40
243.00
149.40
149.40
149.76
6
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