SMJ320C30KGDB Datasheet, PDF (3/9 Pages) Texas Instruments – FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIE

SMJ320C30KGDB
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIE
SGUS019B – NOVEMBER 1995 – REVISED DECEMBER 1998
JEDEC STANDARD
" D Die thickness is approximately 15 mils 1 mil.
D Backside surface finish is silicon.
D Maximum allowable die junction operating temperature is 175°C.
D Glassivation material is compressive nitride.
D Bond pad metal is composed of copper-doped aluminum.
D Percent defective allowed for burned-in die is 5%.
D Life test data is available.
D Configuration control notification
D Group A attribute summary is available (SMJ only).
D Suggested die-attach material is Silverglass (QMI 3555).
D Suggested bond wire size is 1.25 mil.
D ESD rating is Class II.
D Minimum allowable peak process temperature for die attach is 325°C (for QMI 3555).
D Saw kerf is dependent on blade size used.
D Die backside potential is grounded.
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