GC5330 Datasheet, PDF (8/49 Pages) Texas Instruments – Wideband Transmit-Receive Digital Signal Processors

GC5330
GC5337
SLWS226 B – DECEMBER 2010 – REVISED JANUARY 2011
www.ti.com
In WI applications, the GC533x meets multi-carrier 3G and 4G performance standards (PCDE, composite EVM,
and ACLR) at PAR levels down to 6 dB for WCDMA and 7 dB for LTE, and improves the ACLR by over 20 dB at
the PA output. The GC533x integrates easily into the transmit/receive signal chain between Texas Instruments’
high-performance data converters and baseband processors such as the TI TMS320C64xx family. In wireless
repeater applications, the GC533x can provide seamless interfaces to TI data converters, along with receive and
transmit filtering, DDC, and DUC functions.
The GC533x is extremely flexible and can be used in system architectures with different signal types and
TX-by-RX antenna configurations such as 2×2, 2×4, 4×4, and 4×8.
The GC533x EVM system provides an example sector transmit-receive signal chain solution, from the
multi-carrier baseband to the RF antenna.
ABSOLUTE MAXIMUM RATINGS
over recommended operating free-air temperature range (unless otherwise noted)⁽¹⁾
V_DD
V_DDA
V_DDS
V_DDSHV
V_IN
T_stg
Core supply voltage
PLL analog voltage
Digital supply voltage for TX
Digital supply voltage
Input voltage (under/overshoot)
Clamp current for an input/output
Storage temperature
ESD classification
Class 2 (2.5 kV HBM, 500 V CDM, 150 V MM)
Moisture sensitivity
Moisture sensitivity Class 3 (1 week floor life at 30°C / 60% H)
MIN
–0.3
–0.3
–0.3
–0.3
–0.5
–20
–65
MAX
1.32
2
2
3.6
V_DDSHV + 0.5
20
140
UNIT
V
V
V
V
V
mA
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
V_DD
Core supply voltage⁽¹⁾
V_DDA
V_DDS
V_DDSHV
T_C
T_J
Analog supply for PLLs
Digital supply voltage for LVDS I/O
Digital supply voltage CMOS I/O
Case temperature
Junction temperature
310 MHz, 5.7 A max. ⁽²⁾⁽¹⁾
{370 MHz}⁽³⁾
60 mA max. (each)⁽²⁾
700 mA max.⁽²⁾
PC board design dependent
i ⁽⁴⁾
MIN TYP MAX UNIT
1.05 1.1 1.15 V
1.1 1.125 1.15
1.71 1.8 1.89
1.71 1.8 1.89 V
3.15 3.3 3.45 V
–40
30 90 °C
105 °C
(1) Production tested hot using checksum at 310 MHz and maximum supplies. Power scales linearly with frequency with a dc consumption
around 350 mA typical, 700 mA worst case.
(2) Chip specifications are production tested to 90°C case temperature. QA tests are performed at 85°C.
(3) Power consumption is a strong function of the configuration. A calculator is available to estimate power for a specific configuration.
(4) Reliability calculations presume junction temperature 105°C or below. Operation above 105°C junction temperature reduces product
lifetime.
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