CD74HC166 Datasheet, PDF (8/13 Pages) Texas Instruments – High-Speed CMOS Logic 8-Bit Parallel-In/Serial-Out Shift Register

www.ti.com
PACKAGE OPTION ADDENDUM
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
CD54HC166F3A
CD54HCT166F3A
CD74HC166E
CD74HC166EE4
CD74HC166M
CD74HC166M96
CD74HC166M96E4
CD74HC166ME4
CD74HC166MT
CD74HC166MTE4
CD74HCT166E
CD74HCT166EE4
CD74HCT166M
CD74HCT166M96
CD74HCT166M96E4
CD74HCT166ME4
CD74HCT166MT
CD74HCT166MTE4
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
CDIP
CDIP
PDIP
Package
Drawing
J
J
N
PDIP
N
SOIC
D
SOIC
D
SOIC
D
SOIC
D
SOIC
D
SOIC
D
PDIP
N
PDIP
N
SOIC
D
SOIC
D
SOIC
D
SOIC
D
SOIC
D
SOIC
D
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
16
1
TBD
A42 SNPB N / A for Pkg Type
16
1
TBD
A42 SNPB N / A for Pkg Type
16 25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
16 25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
16 40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
16 25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
16 40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
16 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Addendum-Page 1