BQ24170 Datasheet, PDF (8/35 Pages) Texas Instruments – 1.6-MHz Synchronous Switch-Mode Li-Ion and Li-Polymer Stand-Alone Battery Charger

bq24170
bq24172
SLUSAD2A – NOVEMBER 2010 – REVISED NOVEMBER 2010
www.ti.com
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾⁽²⁾
VALUE
UNIT
PVCC, AVCC, ACP, ACN, CMSRC, STAT
–0.3 to 20
ACDRV, BTST
–0.3 to 26
BATDRV, SRP, SRN
–0.3 to 20
Voltage range (with respect to AGND)
SW
FB (bq24172)
–2 to 20
V
–0.3 to 16
OVPSET, REGN, TS, TTC, CELL (bq24170)
–0.3 to 7
VREF, ISET, ACSET
–0.3 to 3.6
PGND
–0.3 to 0.3
Maximum difference voltage
SRP–SRN, ACP-ACN
–0.5 to 0.5
V
Junction temperature range, T_J
Storage temperature range, T_stg
–40 to 155
°C
–55 to 155
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND if not specified. Currents are positive into, negative out of the specified terminal. Consult Packaging
Section of the data book for thermal limitations and considerations of packages.
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
bq24170/2
RGY
UNITS
q_JA
Junction-to-ambient thermal resistance⁽²⁾
y_JT
Junction-to-top characterization parameter⁽³⁾
y_JB
Junction-to-board characterization parameter⁽⁴⁾
24 PINS
35.7
0.4
31.2
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-top characterization parameter, y_JT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining q_JA, using a procedure described in JESD51-2a (sections 6 and 7).
(4) The junction-to-board characterization parameter, y_JB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining q_JA , using a procedure described in JESD51-2a (sections 6 and 7).
RECOMMENDED OPERATING CONDITIONS
Input voltage
Output voltage
Output current (R_SR 10mΩ)
Maximum difference voltage
V_IN
V_OUT
I_OUT
ACP - ACN
SRP–SRN
Operation free-air temperature range, T_A
MIN
4.5
600
–200
–200
–40
MAX
17
13.5
4
200
200
85
UNIT
V
V
A
mV
mV
°C
8
Submit Documentation Feedback
Product Folder Link(s): bq24170 bq24172
Copyright © 2010, Texas Instruments Incorporated