TLE202X Datasheet, PDF (7/66 Pages) Texas Instruments – EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS

TLE202x, TLE202xA, TLE202xB, TLE202xY
EXCALIBUR HIGH-SPEED LOW-POWER PRECISION
OPERATIONAL AMPLIFIERS
SLOS191 – FEBRUARY 1997
TLE2024Y chip information
This chip, when properly assembled, displays characteristics similar to the TLE2024. Thermal compression or
ultrasonic bonding may be used on the doped aluminum-bonding pads. This chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
100
140
1IN +
1IN –
2OUT
2IN +
3IN –
4OUT
VCC ₊
(4)
(3)
+
(2)
–
(7)
+
–
(10)
+
(9)
–
(14)
+
–
(11)
VCC _{– /GND}
(1)
1OUT
(5)
2IN +
(6)
2IN –
(8)
3OUT
(12)
4IN +
(13)
4IN –
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
TJmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
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