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TLE202X Datasheet, PDF (2/66 Pages) Texas Instruments – EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS
TLE202x, TLE202xA, TLE202xB, TLE202xY
EXCALIBUR HIGH-SPEED LOW-POWER PRECISION
OPERATIONAL AMPLIFIERS
SLOS191 – FEBRUARY 1997
TLE2021 AVAILABLE OPTIONS
TA
VIOmax
AT 25°C
SMALL
OUTLINE†
(D)
SSOP‡
(DB)
PACKAGED DEVICES
CHIP
CARRIER
(FK)
CERAMIC DIP
(JG)
PLASTIC DIP
(P)
TSSOP‡
(PW)
CHIP
FORM§
(Y)
0°C to
70°C
200 µV
500 µV
TLE2021ACD
TLE2021CD
TLE2021CDBLE
—
—
TLE2021ACP
—
—
TLE2021CP TLE2021CPWLE TLE2021Y
– 40°C
to
85°C
200 µV
500 µV
TLE2021AID
TLE2021ID
—
—
—
TLE2021AIP
TLE2021IP
—
—
– 55°C 100 µV
—
TLE2021BMFK TLE2021BMJG
—
to
200 µV TLE2021AMD
—
TLE2021AMFK TLE2021AMJG TLE2021AMP
—
—
125°C 500 µV TLE2021MD
TLE2021MFK TLE2021MJG TLE2021MP
† The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2021CDR).
‡ The DB and PW packages are only available left-end taped and reeled.
§ Chip forms are tested at 25°C only.
TLE2022 AVAILABLE OPTIONS
TA
VIOmax
SMALL
AT 25°C OUTLINE†
(D)
SSOP‡
(DB)
PACKAGED DEVICES
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
TSSOP‡
(PW)
CHIP
FORM§
(Y)
0°C 150 µV TLE2022BCD
—
to
300 µV TLE2022ACD
—
—
70°C 500 µV TLE2022CD TLE2022CDBLE
—
—
—
—
TLE2022ACP
—
—
TLE2022CP TLE2022CPWLE TLE2022Y
– 40°C 150 µV TLE2022BID
to
300 µV TLE2022AID
—
85°C 500 µV TLE2022ID
—
—
—
TLE2022AIP
—
—
TLE2022IP
– 55°C 150 µV
—
—
TLE2022BMJG
—
to
300 µV TLE2022AMD
—
TLE2022AMFK TLE2022AMJG TLE2022AMP
—
—
125°C 500 µV TLE2022MD
TLE2022MFK TLE2022MJG TLE2022MP
‡ The D packages are available taped and reeled. To oerder a taped and reeled part, add the suffix R (e.g., TLE2022CDR).
‡ The DB and PW packages are only available left-end taped and reeled.
† Chip forms are tested at 25°C only.
TLE2024 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25°C
SMALL
OUTLINE
CHIP
CARRIER
CERAMIC
DIP
(DW)
(FK)
(J)
500 µV TLE2024BCDW
0°C to 70°C
750 µV TLE2024ACDW
—
—
1000 µV TLE2024CDW
500 µV TLE2024BIDW
– 40°C to 85°C
750 µV TLE2024AIDW
—
—
1000 µV TLE2024IDW
– 55°C to 125°C
500 µV TLE2024BMDW
750 µV TLE2024AMDW
1000 µV TLE2024MDW
† Chip forms are tested at 25°C only.
TLE2024BMFK
TLE2024AMFK
TLE2024MFK
TLE2024BMJ
TLE2024AMJ
TLE2024MJ
PLASTIC
DIP
(N)
TLE2024BCN
TLE2024ACN
TLE2024CN
TLE2024BIN
TLE2024AIN
TLE2024IN
TLE2024BMN
TLE2024AMN
TLE2024MN
CHIP
FORM†
(Y)
—
—
TLE2024Y
—
—
2
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