OPA454 Datasheet, PDF (5/36 Pages) Texas Instruments – High-Voltage (100V), High-Current (50mA) OPERATIONAL AMPLIFIERS, G = 1 Stable

OPA454
www.ti.com
SBOS391 – DECEMBER 2007
ELECTRICAL CHARACTERISTICS: V_S = ±50V (continued)
Boldface limits apply over the specified temperature range, T_A = –40°C to +85°C.
At T_P = +25°C, R_L = 4.8kΩ to mid-supply, V_CM = V_OUT = mid-supply, unless otherwise noted.
PARAMETER
E/D (ENABLE/DISABLE) PIN
E/D Pin, Referenced to E/D Com Pin^(14)(15)
High (output enabled)
V_SD
Low (output disabled)
V_SD
Output Disable Time
Output Enable Time
E/D COM PIN
Voltage Range
POWER SUPPLY
Specified Range
V_S
Operating Voltage Range
Quiescent Current
I_Q
Quiescent Current in Shutdown Mode
TEMPERATURE RANGE
Specified Range
T_A
Operating Range
T_A
Thermal Resistance, Junction-to-Case⁽¹⁶⁾
SO-8 PowerPAD⁽¹⁷⁾
θ_JC
HSOP-20
Thermal Resistance, Junction-to-Ambient
θ_JA
SO-8 PowerPAD⁽¹⁷⁾
HSOP-20 ⁽¹⁸⁾
CONDITIONS
Pin Open or Forced High
Pin Forced Low
I_O = 0
I_O = 0, V_E/D = 0.65V
MIN
E/D Com + 2.5
E/D Com
(V–)
±5
–40
–55
OPA454
TYP
4
3
±50
3.2
150
10
10
24/52
65
MAX
E/D Com + 5
E/D Com +
0.65
(V+) – 5
±50
4
210
+85
+125
UNIT
V
V
µs
µs
V
V
V
mA
µA
°C
°C
°C/W
°C/W
°C/W
°C/W
(14) See typical characteristic curve, I_ENABLE vs V_ENABLE (Figure 46).
(15) High enables the outputs.
(16) T_P is the temperature of the leadframe die pad (exposed thermal pad) of the PowerPAD package.
(17) Lower value is for land area of 1-inch × 1-inch, 2-oz copper. Upper value is for exposed-pad sized area of 1-oz copper.
(18) Value given is for DW-20 package, similar to the DWD package, but without an exposed pad. Actual θ_JA may approach θ_JC by selection
of external heatsink and airflow.
+50V
E/D
100V_PP
10kHz
E/D Com
-50V
R_L
50kW
V_OUT
Figure 1. Feedthrough Capacitance Circuit
Copyright © 2007, Texas Instruments Incorporated
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