OPA454 Datasheet, PDF (2/36 Pages) Texas Instruments – High-Voltage (100V), High-Current (50mA) OPERATIONAL AMPLIFIERS, G = 1 Stable

OPA454
SBOS391 – DECEMBER 2007
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION⁽¹⁾
PRODUCT
OPA454
OPA454
PACKAGE-LEAD
SO-8
HSOP-20 ⁽²⁾
PACKAGE DESIGNATOR
DDA
DWD
PACKAGE MARKING
OPA454
OPA454
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Available Q2, 2008.
ABSOLUTE MAXIMUM RATINGS⁽¹⁾
Supply Voltage
Signal Input Terminals, Voltage⁽²⁾
Signal Input Terminals, Current⁽²⁾
E/D to E/D Com Voltage
Output Short-Circuit⁽³⁾
Operating Temperature
Storage Temperature
Junction Temperature
Human Body Model (HBM)
ESD Rating:
Charged Device Model (CDM)
Machine Model (MM)
V_S = (V+) – (V–)
I_SC
T_J
T_J
OPA454
120
(V–) – 0.3 to (V+) + 0.3
±10
+5.5
Continuous
–55 to +125
–55 to +125
+150
4000
500
150
UNIT
V
V
mA
V
°C
°C
°C
V
V
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3V beyond the supply rails should
be current limited to 10mA or less.
(3) Short-circuit to ground.
PIN ASSIGNMENTS
DDA PACKAGE
SO-8 PowerPAD
(TOP VIEW)
DWD PACKAGE⁽¹⁾
HSOP-20 PowerPAD
(TOP VIEW)
E/D Com (Enable/Disable Common) 1
-IN 2
+IN 3
V- 4
PowerPAD⁽¹⁾
Heat Sink
(Located on
bottom side)
8 E/D (Enable/Disable)
7 V+
6 OUT
5 Status Flag
(1) PowerPAD is internally connected to V–.
Soldering the PowerPAD to the PCB is
always required, even with applications that
have low power dissipation.
V- 1
NC⁽³⁾ 2
NC⁽³⁾ 3
V- 4
+IN 5
NC⁽³⁾ 6
-IN 7
NC⁽³⁾ 8
E/D Com (Enable/Disable Common) 9
V- 10
PowerPAD⁽²⁾
Heat Sink
(Located on
top side)
20 V-
19 NC⁽³⁾
18 NC⁽³⁾
17 Status Flag
16 V_OUT
15 V+
14 NC⁽³⁾
13 NC⁽³⁾
12 E/D (Enable/Disable)
11 V-
(1) Available Q2, 2008.
(2) PowerPAD is internally connected to V–.
(3) NC = No internal connection
2
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