 English |
|
|
|
|
|
|
|
| LP38853_15 Datasheet, PDF (5/28 Pages) Texas Instruments – LP38853 3A Fast-Response High-Accuracy Adjustable LDO Linear Regulator with Enable and Soft-Start | |||
| |||
| ◁ |
LP38853
www.ti.com
SNVS335D â DECEMBER 2006 â REVISED APRIL 2013
Electrical Characteristics (continued)
Unless otherwise specified: VOUT = 0.80V, VIN = VOUT(NOM) + 1V, VBIAS = 3.0V, VEN = VBIAS, IOUT = 10 mA, CIN = COUT = 10 µF,
CBIAS = 1 µF, CSS = open. Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction
temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are specified through test, design, or statistical
correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes
only.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
AC Parameters
PSRR
(VIN)
PSRR
(VBIAS)
Ripple Rejection for VIN Input
Voltage
Ripple Rejection for VBIAS Voltage
VIN = VOUT(NOM) + 1V,
f = 120 Hz
VIN = VOUT(NOM) + 1V,
f = 1 kHz
VBIAS = VOUT(NOM) + 3V,
f = 120 Hz
VBIAS = VOUT(NOM) + 3V,
f = 1 kHz
-
80
-
-
70
-
dB
-
58
-
-
58
-
Output Noise Density
f = 120 Hz
-
1
-
µV/âHz
en
Output Noise Voltage
BW = 10 Hz â 100 kHz
BW = 300 Hz â 300 kHz
-
150
-
-
90
-
µVRMS
Thermal Parameters
TSD
TSD(HYS)
θJ-A
Thermal Shutdown Junction
Temperature
Thermal Shutdown Hysteresis
Thermal Resistance, Junction to
Ambient (5)
θJ-C
Thermal Resistance, Junction to
Case(5) (6)
PFM
DDPAK-7
SO PowerPAD-8
PFM-7
DDPAK-7
SO PowerPAD-8
-
160
-
°C
-
10
-
-
60
-
-
60
-
-
168
-
°C/W
-
3
-
-
3
-
-
11
-
(5) Device power dissipation must be de-rated based on device power dissipation (PD), ambient temperature (TA), and package junction to
ambient thermal resistance (θJA). Additional heat-sinking may be required to ensure that the device junction temperature (TJ) does not
exceed the maximum operating rating. See the Application Information section for details.
(6) For PFM and DDPAK: θJ-C refers to the BOTTOM surface of the package, under the epoxy body, as the 'CASE'. For SO PowerPAD-8:
θJ-C refers to the DAP (aka: Exposed Pad) on BOTTOM surface of the package as the 'CASE'.
Copyright © 2006â2013, Texas Instruments Incorporated
Product Folder Links: LP38853
Submit Documentation Feedback
5
|
▷ |
German
Russian
Spanish
Italian
Polish
Chinese
Japanese
Korean
French
Portuguese