LP38853_15 Datasheet, PDF (3/28 Pages) Texas Instruments – LP38853 3A Fast-Response High-Accuracy Adjustable LDO Linear Regulator with Enable and Soft-Start

LP38853
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PFM-7
Pin #
-
DDPAK-7
Pin #
-
SNVS335D – DECEMBER 2006 – REVISED APRIL 2013
PIN DESCRIPTIONS (continued)
SO PowerPAD-
8
Pin #
DAP
Pin
Symbol
DAP
Pin Description
The SO PowerPAD DAP is a thermal connection only that is
physically attached to the backside of the die, and used as a
thermal heat-sink connection. See the Application Information
section for details.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings⁽¹⁾⁽²⁾
Storage Temperature Range
Lead Temperature Soldering, 5 seconds
ESD Rating
Human Body Model⁽³⁾
Power Dissipation⁽⁴⁾
V_IN Supply Voltage (Survival)
V_BIAS Supply Voltage (Survival)
V_SS SoftStart Voltage (Survival)
V_OUT Voltage (Survival)
I_OUT Current (Survival)
Junction Temperature
−65°C to +150°C
260°C
±2 kV
Internally Limited
−0.3V to +6.0V
−0.3V to +6.0V
−0.3V to +6.0V
−0.3V to +6.0V
Internally Limited
−40°C to +150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but does not ensure specific performance limits. For ensured specifications and conditions,
see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) The human body model is a 100 pF capacitor discharged through a 1.5k resistor into each pin. Test method is per JESD22-A114.
(4) Device power dissipation must be de-rated based on device power dissipation (P_D), ambient temperature (T_A), and package junction to
ambient thermal resistance (θ_JA). Additional heat-sinking may be required to ensure that the device junction temperature (T_J) does not
exceed the maximum operating rating. See the Application Information section for details.
Operating Ratings⁽¹⁾
V_IN Supply Voltage
V_BIAS Supply Voltage
V_EN Voltage
I_OUT
Junction Temperature Range⁽²⁾
0.8V ≤ V_OUT ≤ 1.2V
1.2V < V_OUT ≤ 1.8V
(V_OUT + V_DO) to V_BIAS
3.0V to 5.5V
4.5V to 5.5V
0.0V to V_BIAS
0 mA to 3.0A
−40°C to +125°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but does not ensure specific performance limits. For ensured specifications and conditions,
see the Electrical Characteristics.
(2) Device power dissipation must be de-rated based on device power dissipation (P_D), ambient temperature (T_A), and package junction to
ambient thermal resistance (θ_JA). Additional heat-sinking may be required to ensure that the device junction temperature (T_J) does not
exceed the maximum operating rating. See the Application Information section for details.
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