CC3100MOD_15 Datasheet, PDF (5/41 Pages) Texas Instruments – CC3100MOD SimpleLink™ Certified Wi-Fi® Network Processor Internet-of-Things Module Solution for MCU Applications

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CC3100MOD
SWRS161 – DECEMBER 2014
Table of Contents
1 Module Overview ........................................ 1
1.1 Features .............................................. 1
1.2 Applications........................................... 2
1.3 Description............................................ 2
1.4 Functional Block Diagram ............................ 3
2 Revision History ......................................... 6
3 Terminal Configuration and Functions.............. 7
3.1 CC3100MOD Pin Diagram ........................... 7
3.2 Pin Attributes ......................................... 8
4 Specifications ........................................... 10
4.1 Absolute Maximum Ratings ......................... 10
4.2 Handling Ratings .................................... 10
4.3 Power-On Hours .................................... 10
4.4 Recommended Operating Conditions............... 10
4.5 Brown-Out and Black-Out ........................... 11
4.6 Electrical Characteristics (3.3 V, 25°C) ............. 12
4.7 Thermal Resistance Characteristics for MOB
Package ............................................. 12
4.8 Reset Requirement ................................. 12
4.9 Current Consumption ............................... 13
4.10 WLAN RF Characteristics ........................... 15
4.11 Timing Characteristics............................... 16
5 Detailed Description ................................... 22
5.1 Overview ............................................ 22
5.2 Functional Block Diagram........................... 23
5.3 Wi-Fi Network Processor Subsystem ............... 23
5.4 Power-Management Subsystem .................... 24
5.5 Low-Power Operating Modes ....................... 24
6 Applications, Implementation, and Layout ....... 26
6.1 Reference Schematics .............................. 26
6.2 Bill of Materials...................................... 27
6.3 Layout Recommendations .......................... 27
7 Environmental Requirements and
Specifications ........................................... 31
7.1 Temperature......................................... 31
7.2 Handling Environment .............................. 31
7.3 Storage Condition ................................... 31
7.4 Baking Conditions................................... 31
7.5 Soldering and Reflow Condition .................... 31
8 Product and Documentation Support .............. 33
8.1 Development Support ............................... 33
8.2 Device Nomenclature ............................... 33
8.3 Community Resources .............................. 34
8.4 Trademarks.......................................... 34
8.5 Electrostatic Discharge Caution..................... 34
8.6 Export Control Notice ............................... 34
8.7 Glossary ............................................. 34
9 Mechanical Packaging and Orderable
Information .............................................. 35
9.1 Mechanical Drawing................................. 35
9.2 Package Option ..................................... 36
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