CC3100MOD_15 Datasheet, PDF (31/41 Pages) Texas Instruments – CC3100MOD SimpleLink™ Certified Wi-Fi® Network Processor Internet-of-Things Module Solution for MCU Applications

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CC3100MOD
SWRS161 – DECEMBER 2014
7 Environmental Requirements and Specifications
7.1 Temperature
7.1.1 PCB Bending
The PCB bending specification shall maintain planeness at a thickness of less than 0.1 mm.
7.2 Handling Environment
7.2.1 Terminals
The product is mounted with motherboard through land grid array (LGA). To prevent poor soldering, do
not touch the LGA portion by hand.
7.2.2 Falling
The mounted components will be damaged if the product falls or is dropped. Such damage may cause the
product malfunction.
7.3 Storage Condition
7.3.1 Moisture Barrier Bag Before Opened
A moisture barrier bag must be stored in a temperature of less than 30°C with humidity under 85% RH.
The calculated shelf life for the dry-packed product shall be a 12 months from the date the bag is sealed.
7.3.2 Moisture Barrier Bag Open
Humidity indicator cards must be blue, < 30%.
7.4 Baking Conditions
Products require baking before mounting if:
• Humidity indicator cards read > 30%
• Temp < 30°C, humidity < 70% RH, over 96 hours
Baking condition: 90°C, 12–24 hours
Baking times: 1 time
7.5 Soldering and Reflow Condition
1. Heating method: Conventional Convection or IR/convection
2. Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering
portion or equivalent method.
3. Solder paste composition: Sn/3.0 Ag/0.5 Cu
4. Allowable reflow soldering times: 2 times based on the following reflow soldering profile
(see Figure 7-1).
5. Temperature profile: Reflow soldering shall be done according to the following temperature profile (see
Figure 7-1).
6. Peak temp: 245°C
Copyright © 2014, Texas Instruments Incorporated
Environmental Requirements and Specifications
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