MSP430F551X Datasheet, PDF (48/115 Pages) Texas Instruments – MIXED SIGNAL MICROCONTROLLER

MSP430F551x
MSP430F552x
SLAS590D – OCTOBER 2009 – REVISED APRIL 2010
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Absolute Maximum Ratings⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
Voltage applied at V_CC to V_SS
Voltage applied to any pin (excluding VCORE, VBUS, V18)⁽²⁾
Diode current at any device pin
Storage temperature range, T_stg ⁽³⁾
Maximum junction temperature, T_J
–0.3 V to 4.1 V
–0.3 V to V_CC + 0.3 V
±2 mA
–55°C to 105°C
95°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages referenced to V_SS. VCORE is for internal device usage only. No external DC loading or voltage should be applied.
(3) Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
Thermal Packaging Characteristics
PARAMETER
q_JA Junction-to-ambient thermal resistance, still air
Low-K board (JESD51-3)
High-K board (JESD51-7)
q_JC Junction-to-case thermal resistance
q_JB Junction-to-board thermal resistance
QFP (PN)
QFN (RGC)
BGA (ZQE)
QFP (PN)
QFN (RGC)
BGA (ZQE)
QFP (PN)
QFN (RGC)
BGA (ZQE)
QFP (PN)
QFN (RGC)
BGA (ZQE)
VALUE
70
55
84
45
25
46
12
12
30
22
6
20
UNIT
°C/W
°C/W
°C/W
48
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