MSP430F551X Datasheet, PDF (108/115 Pages) Texas Instruments – MIXED SIGNAL MICROCONTROLLER

PACKAGE OPTION ADDENDUM
www.ti.com
28-May-2010
Orderable Device
MSP430F5527IPN
MSP430F5527IPNR
MSP430F5528IRGCR
MSP430F5528IRGCT
MSP430F5528IZQE
MSP430F5528IZQER
MSP430F5529CY
MSP430F5529IPN
MSP430F5529IPNR
Status ^{(1) Package Type Package}
Drawing
ACTIVE
LQFP
PN
Pins
80
Package Qty
119
ACTIVE
LQFP
PN
80
50
ACTIVE
VQFN
RGC
64
2000
ACTIVE
VQFN
RGC
64
250
ACTIVE
BGA
ZQE
80
MICROSTAR
JUNIOR
ACTIVE
BGA
ZQE
80
MICROSTAR
JUNIOR
PREVIEW DIESALE
Y
0
ACTIVE
LQFP
PN
80
360
2500
1
119
ACTIVE
LQFP
PN
80
1000
Eco Plan ⁽²⁾
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Lead/
Ball Finish
MSL Peak Temp ⁽³⁾
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
SNAGCU Level-3-260C-168 HR
SNAGCU Level-3-260C-168 HR
Call TI Call TI
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-3-260C-168 HR
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Samples
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Samples Not Available
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(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
Addendum-Page 3