TLC227X Datasheet, PDF (46/64 Pages) Texas Instruments – Advanced LinCMOSE RAIL-TO-RAIL OPERATIONAL AMPLIFIERS

TLC227x, TLC227xA
ą
Advanced LinCMOS RAILĆTOĆRAIL
OPERATIONAL AMPLIFIERS
SLOS190G − FEBRUARY 1997 − REVISED MAY 2004
APPLICATION INFORMATION
macromodel information
Macromodel information provided was derived using Microsim Parts, the model generation software used
with Microsim PSpice. The Boyle macromodel (see Note 5) and subcircuit in Figure 59 were generated using
the TLC227x typical electrical and operating characteristics at T_A = 25°C. Using this information, output
simulations of the following key parameters can be generated to a tolerance of 20% (in most cases):
D Maximum positive output voltage swing
D Maximum negative output voltage swing
D Slew rate
D Quiescent power dissipation
D Input bias current
D Open-loop voltage amplification
D Unity gain frequency
D Common-mode rejection ratio
D Phase margin
D DC output resistance
D AC output resistance
D Short-circuit output current limit
NOTE 5: G. R. Boyle, B. M. Cohn, D. O. Pederson, and J. E. Solomon, “Macromodeling of Integrated Circuit Operational Amplifiers”, IEEE Journal
of Solid-State Circuits, SC-9, 353 (1974).
VCC ₊
RP
2
IN −
IN +
1
3
RSS
ISS
10
DP
J1
J2
11
RD1
12
C1
RD2
+
VC
R2
−
53
DC
99
EGND ₊
9
+
VB
−
FB
−
C2
6
GCM
GA
DIN
RO2 ⁹⁰
HLIM
+ _DIP
−
7
+
VLIM
−
8
91
+
VIP
−
92
−
VIN
+
VCC _−
VAD
+
−
4
60
DE
54
−+
VE
RO1
5
OUT
.SUBCKT TLC227x 1 2 3 4 5
C1
11
1214E−12
C2
6
760.00E−12
DC
5
53DX
DE
54
5DX
DLP 90
91DX
DLN 92
90DX
DP
4
3DX
EGND 99
0POLY (2) (3,0) (4,) 0 .5 .5
FB
99
0POLY (5) VB VC VE VLP VLN 0
+ 984.9E3 −1E6 1E6 1E6 −1E6
GA
6
011 12 377.0E−6
GCM 0 6 10 99 134E−9
ISS
3
10DC 216.OE−6
HLIM 90
0VLIM 1K
J1
11
210 JX
J2
12
110 JX
R2
6
9100.OE3
RD1 60
112.653E3
RD2 60
122.653E3
R01
8
550
R02
7
9950
RP
3
44.310E3
RSS 10
99925.9E3
VAD 60
4−.5
VB
9
0DC 0
VC 3 53 DC .78
VE
54
4DC .78
VLIM 7
8DC 0
VLP
91
0DC 1.9
VLN 0
92DC 9.4
.MODEL DX D (IS=800.0E−18)
.MODEL JX PJF (IS=1.500E−12BETA=1.316E-3
+ VTO=−.270)
.ENDS
Figure 59. Boyle Macromodel and Subcircuit
PSpice and Parts are trademarks of MicroSim Corporation.
Macromodels, simulation models, or other models provided by TI,
directly or indirectly, are not warranted by TI as fully representing all
of the specification and operating characteristics of the
semiconductor product to which the model relates.
46
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