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TLC227X Datasheet, PDF (2/64 Pages) Texas Instruments – Advanced LinCMOSE RAIL-TO-RAIL OPERATIONAL AMPLIFIERS | |||
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TLC227x, TLC227xA
Ä
Advanced LinCMOS RAILÄTOÄRAIL
OPERATIONAL AMPLIFIERS
SLOS190G â FEBRUARY 1997 â REVISED MAY 2004
TLC2272 AVAILABLE OPTIONS
TA
0°C to 70°C
VIOmax
At 25°C
SMALL
OUTLINEâ
(D)
950 µV TLC2272ACD
2.5 mV TLC2272CD
CERAMIC
LCC
(FK)
â
â
PACKAGED DEVICES
CERAMIC
DIP
(JG)
â
â
PLASTIC DIP
(P)
TSSOPâ¡
(PW)
TLC2272ACP TLC2272ACPW
TLC2272CP TLC2272CPW
CERAMIC
FLAT PACK
(U)
â
â
950 µV TLC2272AID
â
2.5 mV TLC2272ID
â
â40°C to 125°C
950 µV TLC2272AQD
â
2.5 mV TLC2272QD
â
â
TLC2272AIP
â
â
â
TLC2272IP TLC2272IPW
â
â
TLC2272AQPW
â
â
â
TLC2272QPW
â
â55°C to 125°C
950 µV
2.5 mV
TLC2272AMD TLC2272AMFK TLC2272AMJG TLC2272AMP
TLC2272MD TLC2272MFK TLC2272MJG TLC2272MP
â
â The D packages are available taped and reeled. Add R suffix to the device type (e.g., TLC2272CDR).
â¡ The PW package is available taped and reeled. Add R suffix to the device type (e.g., TLC2272PWR).
§ Chips are tested at 25°C.
TLC2272AMU
TLC2272MU
TLC2274 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25°C
SMALL
OUTLINEâ
(D)
CERAMIC
LCC
(FK)
CERAMIC
DIP
(J)
PLASTIC
DIP
(N)
TSSOPâ¡
(PW)
CERAMIC
FLAT PACK
(W)
0°C to 70°C
950 µV TLC2274ACD
2.5 mV TLC2274CD
â
TLC2274ACN TLC2274ACPW
â
TLC2274CN TLC2274CPW
â
950 µV TLC2274AID
2.5 mV TLC2274ID
â
â40°C to 125°C
950 µV TLC2274AQD
2.5 mV TLC2274QD
â
TLC2274AIN TLC2274AIPW
â
TLC2274IN TLC2274IPW
â
â
â
â
â
â55°C to 125°C
950 µV
2.5 mV
TLC2274AMD TLC2274AMFK TLC2274AMJ
TLC2274MD TLC2274MFK TLC2274MJ
TLC2274AMN
TLC2274MN
â
TLC2274AMW
TLC2274MW
â The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2274CDR).
â¡ The PW package is available taped and reeled.
§ Chips are tested at 25°C.
2
⢠POST OFFICE BOX 655303 DALLAS, TEXAS 75265
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