DAC8164 Datasheet, PDF (42/47 Pages) Texas Instruments – 14-Bit, Quad Channel, Ultra-Low Glitch, Voltage Output DIGITAL-TO-ANALOG CONVERTER with 2.5V, 2ppm/°C Internal Reference

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PACKAGE OPTION ADDENDUM
19-May-2008
PACKAGING INFORMATION
Orderable Device
DAC8164IAPW
DAC8164IAPWG4
DAC8164IAPWR
DAC8164IAPWRG4
DAC8164IBPW
DAC8164IBPWG4
DAC8164IBPWR
DAC8164IBPWRG4
DAC8164ICPW
DAC8164ICPWG4
DAC8164ICPWR
DAC8164ICPWRG4
DAC8164IDPW
DAC8164IDPWG4
DAC8164IDPWR
DAC8164IDPWRG4
Status ⁽¹⁾
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
TSSOP
Package
Drawing
PW
TSSOP
PW
TSSOP
PW
TSSOP
PW
TSSOP
PW
TSSOP
PW
TSSOP
PW
TSSOP
PW
TSSOP
PW
TSSOP
PW
TSSOP
PW
TSSOP
PW
TSSOP
PW
TSSOP
PW
TSSOP
PW
TSSOP
PW
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
16 90 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 90 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 90 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 90 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 90 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 90 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 90 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 90 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1