TL494_15 Datasheet, PDF (4/33 Pages) Unisonic Technologies – VOLTAGE MODE PWM CONTROL CIRCUIT

TL494
SLVS074G – JANUARY 1983 – REVISED JANUARY 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
V_CC
Supply voltage⁽²⁾
V_I
Amplifier input voltage
V_O
Collector output voltage
I_O
Collector output current
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
T_stg
Storage temperature range
MIN
MAX UNIT
41 V
V_CC + 0.3
V
41 V
250 mA
260 °C
–65
150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the network ground terminal.
7.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
Charged device model (CDM), per JEDEC specification JESD22-
C101, all pins
MAX
500
200
UNIT
V
7.3 Recommended Operating Conditions
V_CC
Supply voltage
V_I
Amplifier input voltage
V_O
Collector output voltage
Collector output current (each transistor)
Current into feedback terminal
f_OSC
Oscillator frequency
C_T
Timing capacitor
R_T
Timing resistor
T_A
Operating free-air temperature
TL494C
TL494I
MIN
MAX UNIT
7
40 V
–0.3
V_CC – 2
V
40 V
200 mA
0.3 mA
1
300 kHz
0.47
10000 nF
1.8
500 kΩ
0
70
°C
–40
85
7.4 Thermal Information
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TL494
UNIT
D
DB
N
NS
PW
R_θJA
Package thermal
impedance ^{(1) (2)}
73
82
67
64
108
°C/W
(1) Maximum power dissipation is a function of T_J(max), θ_JA, and T_A. The maximum allowable power dissipation at any allowable ambient
temperature is P_D = (T_J(max) – T_A) / θ_JA. Operating at the absolute maximum T_J of 150°C can affect reliability.
(2) The package thermal impedance is calculated in accordance with JESD 51-7.
4
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