LP38691_15 Datasheet, PDF (4/34 Pages) Texas Instruments – LP3869x/-Q1 500-mA Low-Dropout CMOS Linear Regulators Stable With Ceramic Output Capacitors

LP38691, LP38693, LP38691-Q1, LP38693-Q1
SNVS321N – JANUARY 2005 – REVISED MARCH 2015
www.ti.com
NAME
TO-
252
DAP
—
EN
—
PIN
WSON
√
√
—
3
GND
TAB
2
2
IN
OUT
3
1, 6
1, 6
1
4
4
SNS
—
5
5
SOT-
223
—
1
5
4
3
—
Pin Functions
I/O
DESCRIPTION
—
WSON Only - The DAP (Exposed Pad) functions as a thermal connection when
soldered to a copper plane. See WSON Mounting section for more information.
I
The EN pin allows the part to be turned ON and OFF by pulling this pin high or
low.
Circuit ground for the regulator. For the TO-252 and SOT-223 packages this is
— thermally connected to the die and functions as a heat sink when the soldered
down to a large copper plane.
I
This is the input supply voltage to the regulator. For WSON devices, both IN
pins must be tied together for full current operation (250 mA maximum per pin).
O Regulated output voltage
WSON Only - Output SNS pin allows remote sensing at the load which will
I
eliminate the error in output voltage due to voltage drops caused by the
resistance in the traces between the regulator and the load. This pin must be
tied to OUT.
7 Specifications
7.1 Absolute Maximum Ratings⁽¹⁾⁽²⁾
MIN
MAX
UNIT
Lead temp. (Soldering, 5 seconds)
Power dissipation⁽³⁾
260
°C
Internally Limited
V
V(max) All pins (with respect to GND)
I_OUT ⁽⁴⁾
Junction temperature
Storage temperature, T_stg
–0.3
12
V
Internally Limited
V
–40
150
°C
−65
150
(1) Absolute maximum ratings indicate limits beyond which damage to the component may occur. Operating ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications, see Electrical
Characteristics. Specifications do not apply when operating the device outside of its rated operating conditions.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heatsink values (if a
heatsink is used). When using the WSON package, refer to AN-1187 Leadless Leadframe Package (LLP), SNOA401, and the WSON
Mounting section in this datasheet. If power dissipation causes the junction temperature to exceed specified limits, the device will go into
thermal shutdown.
(4) If used in a dual-supply system where the regulator load is returned to a negative supply, the output pin must be diode clamped to
ground.
7.2 ESD Ratings: LP38691 and LP38693
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
VALUE
±2000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 ESD Ratings: LP38691-Q1 and LP38693-Q1
V_(ESD)
Electrostatic discharge
Human-body model (HBM), per AEC Q100-002⁽¹⁾
VALUE
±2000
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
7.4 Recommended Operating Conditions
V_IN supply voltage
Operating junction temperature
MIN
NOM
MAX UNIT
2.7
10
V
−40
125
°C
4
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