LM3555TLE Datasheet, PDF (4/33 Pages) Texas Instruments – LM3555 Synchronous Boost Converter with 500 mA High Side LED Driver and Dual-Mode Control Interface

LM3555
SNVS594E – JANUARY 2009 – REVISED NOVEMBER 2011
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Thermal Properties
Thermal Resistance Junction-to-Ambient (θ_JA) ⁽¹⁾
60°C/W
(1) Junction-to-ambient thermal resistance (θ_JA) is taken from a thermal modeling result, performed under the conditions and guidelines set
forth in the JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 102mm x 76mm x 1.6mm with a 2x1 array of
thermal vias. The ground plane on the board is 50mm x 50mm. Thickness of copper layers are 36µm/18µm/18µm/3µm
(1.5oz/1oz/1oz/1.5oz). Ambient temperature in simulation is 22°C, still air. Power dissipation is 1W.
4
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