LM3555TLE Datasheet, PDF (3/33 Pages) Texas Instruments – LM3555 Synchronous Boost Converter with 500 mA High Side LED Driver and Dual-Mode Control Interface

LM3555
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A3
B1
B2
B3
C1
C2
C3
D1
D2
D3
VIN
SW
TORCH
IND
VOUT
STROBE
I2C / EN
VLED
SDA / EN2
SCL / EN1
SNVS594E – JANUARY 2009 – REVISED NOVEMBER 2011
Pin Descriptions (continued)
I
Input voltage pin of the device. Connect input bypass capacitor very close
to this pin.
Inductor connection.
I
Torch pin. Driving this pin high enables Torch mode.
O
Red indicator LED current source. Connect to RED LED anode.
O
Boost output. Connect output bypass capacitor very close to this pin.
I/O
Strobe signal input pin to synchronize flash pulse in I²C mode. This signal
usually comes from the camera processor. In Simple logic mode this pin,
when tied to a voltage rail through a pull-up resistor indicates the number
of LEDs in the system.
I
I2C / EN-logic selection. High = I²C mode, Low = Simple logic mode.
O
LED current source. Connect to the anode of the Flash LED. One or two
LEDs can be connected in series.
I/O
EN2 signal pin in Simple logic mode. I²C data signal in I²C mode.
I
EN1 signal pin in Simple logic mode. I²C clock signal in I²C mode.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings ^{(1) (2)}
VIN
TORCH, IND, STROBE, I2C/EN, SDA/EN2, SCL/EN1
SW
VOUT, VLED
Continuous Power Dissipation ⁽³⁾
Junction Temperature (T_J-MAX) )
Storage Temperature Range
Maximum Lead Temperature (Soldering)
ESD Rating
Human Body Model⁽⁵⁾
-0.3V to +6V
-0.3V to (V_IN+0.3V) w/ 6.0V max.
+12V
+10V
Internally Limited
+150°C
-55°C to +150°C
(4)
2.5kV
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under
which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed
performance limits and associated test conditions, see the Electrical Characteristics tables.
(2) All voltages are with respect to the potential at the GND pin.
(3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T_J=150°C (typ.) and
disengages at T_J=135°C (typ.). Thermal shutdown is guaranteed by design.
(4) For detailed soldering specifications and information, please refer to Texas Instruments Application Note: AN-1112: Micro SMD Wafer
Level Chip Scale Package. For Recommended Soldering Profiles.
(5) The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. (MIL-STD-883 3015.7)
Operating Ratings ^{(1) (2)}
Input Voltage Range
Junction Temperature Range (T_J)
Ambient Temperature Range (T_A)⁽³⁾
2.5 to 5.5V
−30°C to +125°C
−30°C to +85°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under
which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed
performance limits and associated test conditions, see the Electrical Characteristics tables.
(2) All voltages are with respect to the potential at the GND pin.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be de-rated. Maximum ambient temperature (T_A-MAX) is dependent on the maximum operating junction temperature (T_J-MAX-OP =
+125°C), the maximum power dissipation of the device in the application (P_D-MAX), and the junction-to-ambient thermal resistance of the
part/package in the application (θ_JA), as given by the following equation: T_A-MAX = T_J-MAX-OP – (θ_JA × P_D-MAX).
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