BQ28400PWR Datasheet, PDF (4/24 Pages) Texas Instruments – Tablet PC and Netbook 2-Series Cell Li-Ion Battery Gas Gauge and Protection

bq28400
SLUSA61A – OCTOBER 2010 – REVISED DECEMBER 2010
www.ti.com
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
bq28400
PW
UNITS
q_JA
q_JC(top)
q_JB
y_JT
y_JB
q_JC(bottom)
Junction-to-ambient thermal resistance⁽²⁾
Junction-to-case(top) thermal resistance ⁽³⁾
Junction-to-board thermal resistance ⁽⁴⁾
Junction-to-top characterization parameter ⁽⁵⁾
Junction-to-board characterization parameter ⁽⁶⁾
Junction-to-case(bottom) thermal resistance ⁽⁷⁾
20 PINS
91.7
20.4
45.6
0.5
43.3
n/a
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific
JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, y_JT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining q_JA, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, y_JB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining q_JA , using a procedure described in JESD51-2a (sections 6 and 7).
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature (unless otherwise noted) ⁽¹⁾
Supply voltage range, V_MAX
Input voltage range, V_IN
Maximum Operational VSS current,
I_SS
Ambient Temperature, T_A
Storage temperature range, T_STG
ESD Human Body Model⁽²⁾
ESD Machine Model
PACK w.r.t. V_SS
VC1, BAT
VC2
SRP, SRN
General Purpose open-drain I/O pins: SMBD, SMBC
General Purpose push-pull I/O pins: TS1, PRES, CB_EN
Input voltage range to all other pins, V_IN relative to V_SS
DSG, CHG, ZVCHG
FUSE
RBI, REG27
All pins except VC1 and VC2
VC1 and VC2
All pins
Value/Unit
–0.3 to 34 V
V_VC2 –0.3 to V_VC2 + 8.5 or 34 V,
whichever is lower
V_VSRP –0.3 to V_VSRP + 8.5 V
–0.3 to V_REG27
V_SS –0.3 V to 6 V
–0.3 V to V_REG27 + 0.3 V
–0.3 V to V_REG27 + 0.3 V
–0.3 to BAT
–0.3 to [BAT or PACK] (whichever is
lower)
–0.3 to 2.75 V
50 mA
–20 to 110°C
–65 to 150°C
2 kV
1 kV
200 V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin.
4
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): bq28400