AMC1200_15 Datasheet, PDF (4/31 Pages) Texas Instruments – AMC1200/B Fully-Differential Isolation Amplifier

AMC1200, AMC1200B
SBAS542D – APRIL 2011 – REVISED JULY 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
Over the operating ambient temperature range, unless otherwise noted.⁽¹⁾
MIN
Supply voltage, VDD1 to GND1 or VDD2 to GND2
–0.5
Analog input voltage at VINP, VINN
GND1 – 0.5
Input current to any pin except supply pins
–10
Maximum junction temperature, T_J Max
Storage Temperature, T_stg
–65
MAX
6
VDD1 + 0.5
10
150
150
UNIT
V
V
mA
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute
maximum rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM) JEDEC standard 22, test method A114-
C.01 ⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
VALUE
±2500
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
T_A
VDD1
VDD2
Operating ambient temperature range
High-side power supply
Low-side power supply
MIN
NOM
MAX UNIT
–40
105
°C
4.5
5
5.5
V
2.7
5
5.5
V
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
AMC1200, AMC1200B
DUB (SOP) DWV (SOIC)
UNIT
8 PINS
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
75.1
102.8
°C/W
61.6
49.8
°C/W
39.8
56.6
°C/W
27.2
16
°C/W
39.4
55.2
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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