AMC1200_15 Datasheet, PDF (12/31 Pages) Texas Instruments – AMC1200/B Fully-Differential Isolation Amplifier

AMC1200, AMC1200B
SBAS542D – APRIL 2011 – REVISED JULY 2015
Feature Description (continued)
PARAMETER
PD Pollution degree
7.3.2 IEC 61000-4-5 Ratings
TEST CONDITIONS
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MIN
TYP
MAX UNIT
2
°
V_IOSM
PARAMETER
Surge immunity
7.3.3 IEC 60664-1 Ratings⁽¹⁾
TEST CONDITIONS
1.2-μs/50-μs voltage surge and 8-μs/20-μs current surge
VALUE
±6000
UNIT
V
PARAMETER
Basic isolation group
Installation classification
TEST CONDITIONS
Material group
Rated mains voltage ≤ 150 V_RMS
Rated mains voltage ≤ 300 V_RMS
Rated mains voltage ≤ 400 V_RMS
Rated mains voltage < 600 V_RMS
(1) Over operating free-air temperature range (unless otherwise noted).
7.3.4 Package Characteristics⁽¹⁾
SPECIFICATION
II
I-IV
I-IV
I-III
I-III
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
L(I01)
Minimum air gap (clearance)
Shortest terminal to terminal
distance through air
DWV package
DUB package
8
7
mm
mm
L(I02)
Minimum external tracking
(creepage)
Shortest terminal to terminal
distance across the package
surface
DWV package
DUB package
8
7
mm
mm
CTI
Tracking resistance
(comparative tracking index)
DIN IEC 60112/VDE 0303 part 1
≥ 400
V
Minimum internal gap
(internal clearance)
Distance through the insulation
0.014
mm
R_IO Isolation resistance
Input to output, V_IO = 500 V, all pins on each side of
the barrier tied together to create a two-terminal
device, T_A < 85°C
Input to output, V_IO = 500 V,
85°C ≤ T_A < T_A max
C_IO
Barrier capacitance input to
output
V_I = 0.5 V_PP at 1 MHz
> 10¹²
Ω
> 10¹¹
Ω
1.2
pF
C_I
Input capacitance to ground V_I = 0.5 V_PP at 1 MHz
3
pF
(1) Creepage and clearance requirements should be applied according to the specific equipment isolation standards of a specific
application. Take care to maintain the creepage and clearance distance of the board design to ensure that the mounting pads of the
isolator on the printed-circuit-board (PCB) do not reduce this distance. Creepage and clearance on a PCB become equal according to
the measurement techniques shown in the TI Isolation Glossary. Techniques such as inserting grooves and/or ribs on the PCB are used
to help increase these specifications.
7.3.5 IEC Safety Limiting Values
Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output (I/O)
circuitry. A failure of the I/O circuitry can allow low resistance to ground or the supply and, without current
limiting, dissipate sufficient power to overheat the die and damage the isolation barrier, potentially leading to
secondary system failures.
PARAMETER
I_S Safety input, output, or supply current
T_C Maximum case temperature
12
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TEST CONDITIONS
θ_JA = 246°C/W, V_IN = 5.5 V, T_J = 150°C, T_A = 25°C
MIN TYP MAX UNIT
10 mA
150 °C
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