ADS7229 Datasheet, PDF (38/46 Pages) Texas Instruments – LOW-POWER, 12-BIT, 1MHz, SINGLE/DUAL UNIPOLAR INPUT, ANALOG-TO-DIGITAL CONVERTERS WITH SERIAL INTERFACE

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PACKAGE OPTION ADDENDUM
11-Jul-2008
PACKAGING INFORMATION
Orderable Device
ADS7229IPW
ADS7229IPWG4
ADS7229IPWR
ADS7229IPWRG4
ADS7229IRSAR
ADS7229IRSARG4
ADS7229IRSAT
ADS7229IRSATG4
ADS7229RSAR
ADS7230IPW
ADS7230IPWG4
ADS7230IPWR
ADS7230IPWRG4
ADS7230IRSAR
ADS7230IRSARG4
ADS7230IRSAT
ADS7230IRSATG4
Status ⁽¹⁾
ACTIVE
Package
Type
TSSOP
Package
Drawing
PW
ACTIVE TSSOP
PW
ACTIVE TSSOP
PW
ACTIVE TSSOP
PW
ACTIVE
QFN
RSA
ACTIVE
QFN
RSA
ACTIVE
QFN
RSA
ACTIVE
QFN
RSA
PREVIEW
ACTIVE
QFN
TSSOP
RSA
PW
ACTIVE TSSOP
PW
ACTIVE TSSOP
PW
ACTIVE TSSOP
PW
ACTIVE
QFN
RSA
ACTIVE
QFN
RSA
ACTIVE
QFN
RSA
ACTIVE
QFN
RSA
Pins Package Eco Plan ⁽²⁾ Lead/Ball Finish MSL Peak Temp ⁽³⁾
Qty
16 90 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 90 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 3000
TBD
Call TI
Call TI
16 90 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 90 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
16 250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check}
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1