THS4211 Datasheet, PDF (34/41 Pages) Texas Instruments – LOW-DISTORTION HIGH-SPEED VOLTAGE FEEDBACK AMPLIFIER

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Thermal Pad Mechanical Data
DGN (S–PDSO–G8)
THERMAL INFORMATION
The DGN PowerPAD™ package incorporates an exposed thermal die pad that is designed to be attached directly
to an external heat sink. When the thermal die pad is soldered directly to the printed circuit board (PCB), the PCB
can be used as a heatsink. In addition, through the use of thermal vias, the thermal die pad can be attached directly
to a ground plane or special heat sink structure designed into the PCB. This design optimizes the heat transfer from
the integrated circuit (IC).
For additional information on the PowerPAD package and how to take advantage of its heat dissipating abilities, refer to
Technical Brief, PowerPAD Thermally Enhanced Package, Texas Instruments Literature No. SLMA002 and
Application Brief, PowerPAD Made Easy, Texas Instruments Literature No. SLMA004. Both documents are available
at www.ti.com. See Figure 1 for DGN package exposed thermal die pad dimensions.
8
1,78
MAX
5
1
Exposed Thermal
Die Pad
4
1,73
MAX
Bottom View
NOTE: All linear dimensions are in millimeters.
Figure 1. DGN Package Exposed Thermal Die Pad Dimensions
PPTD041
PowerPAD is a trademark of Texas Instruments.
1