THS4211 Datasheet, PDF (33/41 Pages) Texas Instruments – LOW-DISTORTION HIGH-SPEED VOLTAGE FEEDBACK AMPLIFIER

THERMAL PAD MECHANICAL DATA
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DRB (S-PDSO-N8)
THERMAL INFORMATION
This package incorporates an exposed thermal pad that is designed to be attached directly to an external
heatsink. The thermal pad must be soldered directly to the printed circuit board (PCB). After soldering, the PCB
can be used as a heatsink. In addition, through the use of thermal vias, the thermal pad can be attached directly
to a ground plane or special heatsink structure designed into the PCB. This design optimizes the heat transfer
from the integrated circuit (IC).
For additional information on the Quad Flatpack No-Lead (QFN) package and how to take advantage of its heat
dissipating abilities, refer to Application Report, Quad Flatpack No-Lead Logic Packages, Texas Instruments
Literature No. SCBA017 and Application Report, 56-Pin Quad Flatpack No-Lead Logic Package, Texas
Instruments Literature No. SCEA032. Both documents are available at www.ti.com.
The exposed thermal pad dimensions for this package are shown in the following illustration.
1
4
1,50+00,,1150
4x0,23
Exposed Thermal Pad
2x0,65
8
5
1,75+00,,1150
4x0,625
NOM
NOTE: All linear dimensions are in millimeters
Bottom View
Exposed Thermal Pad Dimensions
QFND058