LP2953_15 Datasheet, PDF (33/41 Pages) Texas Instruments – LP295x Adjustable Micropower Low-Dropout Voltage Regulators

www.ti.com
LP2952-N, LP2952A, LP2953, LP2953A
SNVS095F – MAY 2004 – REVISED MARCH 2015
Power Dissipation: Heatsink Requirements (Industrial Temperature Range Devices) (continued)
The heatsink is made using the PC board copper. The heat is conducted from the die, through the lead frame
(inside the part), and out the pins which are soldered to the PC board. The pins used for heat conduction are
given in Table 2.
Table 2. Heat Conducting Pins
PART
LP2953IN, LP2953AIN
LP2953IN-3.3, LP2953AIN-3.3
LP2952IM, LP2952AIM
LP2952IM-3.3, LP2952AIM-3.3
LP2953IM, LP2953AIM
LP2953IM-3.3, LP2953AIM-3.3
PACKAGE
16-pin PDIP
16-pin surface mount (SOIC)
PINS
4, 5, 12, 13
1, 8, 9, 16
Figure 49 shows copper patterns which may be used to dissipate heat from the LP2952 and LP2953.
* For best results, use L = 2H.
** 14-Pin PDIP is similar, see Table 2 for pins designated for heatsinking.
Figure 49. Copper Heatsink Patterns
Copyright © 2004–2015, Texas Instruments Incorporated
Submit Documentation Feedback
33
Product Folder Links: LP2952-N LP2952A LP2953 LP2953A