LP2953_15 Datasheet, PDF (2/41 Pages) Texas Instruments – LP295x Adjustable Micropower Low-Dropout Voltage Regulators

LP2952-N, LP2952A, LP2953, LP2953A
SNVS095F – MAY 2004 – REVISED MARCH 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 5
6.5 Electrical Characteristics: 3.3-V Versions ................. 5
6.6 Electrical Characteristics: 5-V Versions .................... 5
6.7 Electrical Characteristics: All Voltage Options .......... 6
6.8 Typical Characteristics .............................................. 9
7 Detailed Description ............................................ 14
7.1 Overview ................................................................. 14
7.2 Functional Block Diagrams ..................................... 14
7.3 Feature Description................................................. 15
7.4 Device Functional Mode ......................................... 16
8 Application and Implementation ........................ 17
8.1 Application Information............................................ 17
8.2 Typical Applications ................................................ 21
9 Power Supply Recommendations...................... 30
10 Layout................................................................... 31
10.1 Layout Guidelines ................................................. 31
10.2 Layout Example .................................................... 31
10.3 Power Dissipation: Heatsink Requirements
(Industrial Temperature Range Devices) ................. 32
11 Device and Documentation Support ................. 34
11.1 Related Links ........................................................ 34
11.2 Trademarks ........................................................... 34
11.3 Electrostatic Discharge Caution ............................ 34
11.4 Glossary ................................................................ 34
12 Mechanical, Packaging, and Orderable
Information ........................................................... 34
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (December 2014) to Revision F
Page
• Deleted "Assured" .................................................................................................................................................................. 1
• Changed "Output Pulldown Crowbar" to "Automatic Output Discharge" ............................................................................... 1
• Changed "internal crowbar" to "automatic output discharge" ................................................................................................. 1
• Added word "input" after "battery" in Features and Description ............................................................................................. 1
• Changed pin names for IN and OUT to match TI nomenclature; fix typos ............................................................................ 1
• Changed max junc. temp from 125°C to 150°C .................................................................................................................... 4
• Changed wording of footnote 12 ........................................................................................................................................... 8
• Added second bullet for "LP2953 versions only" ................................................................................................................. 14
• Added Automatic Output Dischange subsection ................................................................................................................. 16
• Deleted sentence "To achieve the smallest form factor, the TO-92 package is selected.".................................................. 22
• Changed "With an efficiency of 83.3% and a 250-mA maximum load, the internal power dissipation is 250 mW,
which corresponds to a 19.2°C junction temperature rise for the SOIC package." to "With a V_IN – V_OUT differential of
1 V and a maximum load current of 250 mA the internal junction temperature (T_J) of the SOIC package will rise
19.2° above the ambient temperature."................................................................................................................................ 22
• Deleted "Thermal Resistance for Various Copper Heatsinking Patterns" table ................................................................... 33
Changes from Revision D (September 2013) to Revision E
Page
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section; updated
Thermal Information values; deleted obsolete LP2953AM references .................................................................................. 1
Changes from Revision C (March 2005) to Revision D
Page
• Changed layout of National Data Sheet to TI format ........................................................................................................... 30
2
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