CC1310_15 Datasheet, PDF (31/46 Pages) Texas Instruments – CC1310 SimpleLink Ultra-Low Power Sub-1 GHz Wireless MCU

www.ti.com
CC1310
SWRS181A – SEPTEMBER 2015 – REVISED SEPTEMBER 2015
7 Application, Implementation, and Layout
NOTE
Information in the following Applications section is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes. Customers should validate and test
their design implementation to confirm system functionality.
Few external components are required for the operation of the CC1310 device. Figure 7-1 shows a typical
application circuit.
The board layout greatly influences the RF performance of the CC1310 device.
On the Texas Instruments CC1310EM-7XD-7793, the optimal differential impedance seen from the RF
pins into the balun and filter and antenna is 44 +j15.
Optional Inductor.
Only Needed for
DCDC Operation
Red = Not Necessary if Internal Bias is Used
Pin 3 (RXTX)
Pin 2 (RF N)
Pin 1 (RF P)
Differential Operation
Antenna
(50 )
DC Block
CC13xx
(GND exposed die
attached pad)
Pin 3 (RXTX)
Pin 2 (RF N)
Pin 1 (RF P)
Red = Not Necessary if Internal Bias is Used
Pin 2 (RF N)
Pin 1 (RF P)
Single-Ended Operation
Antenna
(50 )
DC Block
24MHz
XTAL
(Load Caps
on Chip)
Red = Not Necessary if Internal Bias is Used
Pin 3 (RXTX)
Pin 2 (RF N)
Single-Ended
Operation With
Antenna Diversity
Pin 1 (RF P)
Antenna
(50 )
DC Block
Antenna
(50 )
DC Block
Figure 7-1 does not show decoupling capacitors for power pins. For a complete reference design, see the product
folder on www.ti.com.
Figure 7-1. Differential Reference Design
Copyright © 2015, Texas Instruments Incorporated
Application, Implementation, and Layout
31
Submit Documentation Feedback
Product Folder Links: CC1310