TLC5942 Datasheet, PDF (3/33 Pages) Texas Instruments – 16-Channel, 12-Bit PWM LED Driver with 7-Bit Dot Correction

TLC5942
www.ti.com
SBVS096B – OCTOBER 2007 – REVISED OCTOBER 2007
RECOMMENDED OPERATING CONDITIONS
At T_A= –40°C to +85°C, unless otherwise noted.
PARAMETER
DC Characteristics: VCC = 3 V to 5.5 V
VCC
Supply voltage
V_O
Voltage applied to output
V_IH
High-level input voltage
V_IL
Low-level input voltage
I_OH
High-level output current
I_OL
Low-level output current
I_OLC
Constant output sink current
T_A
Operating free-air temperature
T_J
Operating junction
temperature
AC Characteristics: VCC = 3 V to 5.5 V
f_{CLK (dcsclk)}
f_{CLK (gssclk)}
Data shift clock frequency
Data shift/grayscale control
clock frequency
T_WH0 / T_WL0
T_WH1
Pulse duration
T_SU0
T_SU1
T_SU2
Setup time
T_SU3
T_H0
T_H1
Hold time
TEST CONDITIONS
OUT0 to OUT15
GSSOUT, DCSOUT
GSSOUT, DCSOUT
OUT0 to OUT15
DCSCLK
GSSCLK
GSSCLK (see Figure 9),
DCSCLK (see Figure 10)
XGSLAT, BLANK (see Figure 9),
XDCLAT (see Figure 10)
GSSIN–GSSCLK ↑ (see Figure 9),
DCSIN–DCSCLK ↑ (see Figure 10)
BLANK ↓– GSSCLK ↑
(see Figure 9)
XGSLAT ↑ – GSSCLK↑
(see Figure 9),
XDCLAT ↑ – DCSCLK↑
(see Figure 10)
XGSLAT ↓ – GSSCLK↑
(see Figure 9 and Figure 11)
GSSIN–GSSCLK ↑ (see Figure 9),
DCSIN–DCSCLK ↑ (see Figure 10)
XGSLAT ↑ – GSSCLK↑
(see Figure 9),
XDCLAT ↑ – DCSCLK↑
(see Figure 10)
TLC5942
MIN
NOM
MAX
3.0
0.7 × VCC
GND
–40
–40
5.5
17
VCC
0.3 × VCC
–1
1
50
+85
+125
30
30
10
30
3
10
100
15
3
30
UNIT
V
V
V
V
mA
mA
mA
°C
°C
MHz
MHz
ns
ns
ns
ns
ns
ns
ns
ns
DISSIPATION RATINGS
PACKAGE
HTSSOP-28 with
PowerPAD soldered⁽¹⁾
HTSSOP-28 with
PowerPAD not soldered⁽²⁾
QFN-32 ⁽³⁾
DERATING FACTOR
ABOVE T_A = +25°C
31.67 mW/°C
16.21 mW/°C
27.86 mW/°C
T_A < +25°C
POWER RATING
3958 mW
2026 mW
3482 mW
T_A = +70°C
POWER RATING
2533 mW
1296 mW
2228 mW
T_A = +85°C
POWER RATING
2058 mW
1053 mW
1811 mW
(1) With PowerPAD soldered onto copper area on printed circuit board (PCB); 2 oz. copper. For more information, see SLMA002 (available
for download at www.ti.com).
(2) With PowerPAD not soldered onto copper area on PCB.
(3) The package thermal impedance is calculated in accordance with JESD51-5.
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TLC5942
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