LP38500-ADJ Datasheet, PDF (3/23 Pages) National Semiconductor (TI) – 1.5A FlexCap Low Dropout Linear Regulator for 2.7V to 5.5V Inputs

LP38500-ADJ, LP38502-ADJ
www.ti.com
Pin #
1
2
3
4
5
DAP
SNVS539F – NOVEMBER 2007 – REVISED APRIL 2013
PIN DESCRIPTIONS FOR DDPAK/TO-263 and PFM PACKAGES
Designation
Function
EN
Enable (LP38502 only). Pull high to enable the output, low to disable the output. This pin has
no internal bias and must be either tied to the input voltage, or actively driven.
N/C
In the LP38500, this pin has no internal connections. It can be left floating or used for trace
routing.
IN
Input Supply
GND
Ground
OUT
Regulated Output Voltage
ADJ
Sets output voltage
DAP
The DAP is used to remove heat from the device by conducting it to the copper clad area on
the PCB which acts as the heatsink. The DAP is electrically connected to the backside of the
die. The DAP must be connected to ground potential, but can not be used as the only ground
connection.
Connection Diagrams for WSON Package
Figure 5. 8-Pin WSON, Top View (LP38500SD-ADJ, Figure 6. 8-Pin WSON, Top View (LP38502SD-ADJ,
LP38500ASD-ADJ)
LP38502ASD-ADJ)
See NGS0008C Package
See NGS0008C Package
Pin #
1
2
3, 4
5, 6, 7
8
DAP
Designation
GND
IN
EN
IN
OUT
ADJ
DAP
PIN DESCRIPTIONS FOR WSON PACKAGE
Function
Ground
Input Supply (LP38500 only). Input Supply pins share current and must be connected together
on the PC Board.
Enable (LP38502 only). Pull high to enable the output, low to disable the output. This pin has
no internal bias and must be either tied to the input voltage, or actively driven.
Input Supply. Input Supply pins share current and must be connected together on the PC
Board.
Regulated Output Voltage. Output pins share current and must be connected together on the
PC Board.
Sets output voltage
The DAP is used to remove heat from the device by conducting it to a copper clad area on the
PCB which acts as a heatsink. The DAP is electrically connected to the backside of the die. The
DAP must be connected to ground potential, but can not be used as the only ground
connection.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Copyright © 2007–2013, Texas Instruments Incorporated
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Product Folder Links: LP38500-ADJ LP38502-ADJ