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AMC1100_15 Datasheet, PDF (3/33 Pages) Texas Instruments – AMC1100 Fully-Differential Isolation Amplifier
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5 Pin Configuration and Functions
AMC1100
SBAS562A – APRIL 2012 – REVISED DECEMBER 2014
DUB and DWV Packages
SOP-8 and SOIC-8
(Top View)
VDD1 1
VINP 2
VINN 3
GND1 4
8 VDD2
7 VOUTP
6 VOUTN
5 GND2
PIN
NAME
NO.
GND1
4
GND2
5
VDD1
1
VDD2
8
VINN
3
VINP
2
VOUTN
6
VOUTP
7
Pin Descriptions
FUNCTION
Power
Power
Power
Power
Analog input
Analog input
Analog output
Analog output
High-side analog ground
Low-side analog ground
High-side power supply
Low-side power supply
Inverting analog input
Noninverting analog input
Inverting analog output
Noninverting analog output
DESCRIPTION
6 Specifications
6.1 Absolute Maximum Ratings
over the operating ambient temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
Supply voltage, VDD1 to GND1 or VDD2 to GND2
–0.5
6
V
Analog input voltage at VINP, VINN
GND1 – 0.5
VDD1 + 0.5
V
Input current to any pin except supply pins
±10
mA
Maximum junction temperature, TJ Max
Storage temperature range, Tstg
150
°C
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged device model (CDM), per JEDEC specification JESD22-
C101 (2)
VALUE
±2500
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
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