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| TPA2051D3 Datasheet, PDF (26/33 Pages) Texas Instruments – 2.9 W/Channel Mono Class-D Audio Subsystem with DirectPath™ Headphone Amplifier & SpeakerGuard™ | |||
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TPA2051D3
SLOS641 â JUNE 2009 ...................................................................................................................................................................................................... www.ti.com
CI = (2p
1
´ RI
´ ¦C )
(2)
If the corner frequency is within the audio band, the capacitors should have a tolerance of ±10% or better,
because any mismatch in capacitance causes an impedance mismatch at the corner frequency and below.
BOARD LAYOUT
In making the pad size for the WCSP balls, it is recommended that the layout use nonsolder mask defined
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the
opening size is defined by the copper pad width. Figure 41 and Table 8 shows the appropriate diameters for a
WCSP layout. The TPA2051D3 evaluation module (EVM) layout is shown in the next section as a layout
example.
Figure 41. Land Pattern Dimensions
26
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Copyright © 2009, Texas Instruments Incorporated
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