THS4041 Datasheet, PDF (25/28 Pages) Texas Instruments – 165-MHz C-STABLE HIGH-SPEED AMPLIFIERS

DGN (S-PDSO-G8)
0,65
8
THS4041, THS4042
165-MHz C-STABLE HIGH-SPEED AMPLIFIERS
SLOS237B– MAY 1999 – REVISED FEBRUARY 2000
MECHANICAL INFORMATION
PowerPAD™ PLASTIC SMALL-OUTLINE PACKAGE
0,38
0,25
5
0,25 M
3,05 4,98
2,95 4,78
Thermal Pad
(See Note D)
0,15 NOM
1
4
3,05
2,95
Gage Plane
0°– 6°
0,25
0,69
0,41
1,07 MAX
0,15
0,05
Seating Plane
0,10
4073271/A 01/98
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions include mold flash or protrusions.
D. The package thermal performance may be enhanced by attaching an external heat sink to the thermal pad. This pad is electrically
and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MO-187
PowerPAD is a trademark of Texas Instruments Incorporated.
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