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BQ24600_1 Datasheet, PDF (25/31 Pages) Texas Instruments – Stand-Alone Synchronous Switch-Mode Li-Ion or Li-Polymer Battery Charger with Low Iq
bq24600
www.ti.com
SLUS891 – FEBRUARY 2010
under PowerPAD is highly recommended.
8. It is critical that the exposed PowerPAD on the backside of the IC package be soldered to the PCB ground.
Ensure that there are sufficient thermal vias directly under the IC, connecting to the ground plane on the
other layers.
9. Decoupling capacitors should be placed next to the IC pins and make trace connection as short as possible.
10. All via size and number should be enough for a given current path.
SW
L1
R1
VBAT
High
VIN
Frequency
Current
BAT
C1
Path
PGND
C2
C3
Figure 19. High Frequency Current Path
Current Direction
RSNS
Current Sensing Direction
To SRP - SRN pin
Figure 20. Sensing Resistor PCB Layout
Refer to the EVM design (SLUU410) for the recommended component placement with trace and via locations.
For the QFN information, refer to SCBA017 and SLUA271.
Copyright © 2010, Texas Instruments Incorporated
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