BQ24230 Datasheet, PDF (25/33 Pages) Texas Instruments – USB-FRIENDLY LITHIUM-ION BATTERY CHARGER AND POWER-PATH MANAGEMENT IC

bq24230
bq24232
www.ti.com .......................................................................................................................................... SLUS821A – OCTOBER 2008 – REVISED DECEMBER 2008
CHG and PGOOD
LED Status: connect a 1.5-kΩ resistor in series with a LED between OUT and CHG and OUT and PGOOD.
Processor Monitoring Status: connect a pullup resistor (approximately 100 kΩ) between the processor’s power
rail and CHG and PGOOD.
SELECTING IN, OUT, AND BAT PIN CAPACITORS
In most applications, all that is needed is a high-frequency decoupling capacitor (ceramic) on the power pin,
input, output, and battery pins. Using the values shown on the application diagram is recommended. After
evaluation of these voltage signals with real system operational conditions, the user can determine if capacitance
values can be adjusted toward the minimum recommended values (dc load application) or higher values for fast,
high-amplitude, pulsed load applications. ???Note if designed high input voltage sources (bad adapters or wrong
adapters), the capacitor needs to be rated appropriately. Ceramic capacitors are tested to 2x their rated values
so a 16-V capacitor may be adequate for a 30-V transient (verify tested rating with capacitor manufacturer).
THERMAL PACKAGE
The bq2423x is packaged in a thermally enhanced MLP package. The package includes a thermal pad to
provide an effective thermal contact between the IC and the printed-circuit board (PCB). The power pad must be
directly connected to the Vss pin. Full PCB design guidelines for this package are provided in the application
report entitled: QFN/SON PCB Attachment (SLUA271). The most common measure of package thermal
performance is thermal impedance (θ_JA ) measured (or modeled) from the chip junction to the air surrounding the
package surface (ambient). The mathematical expression for θ_JA is:
θ_JA = (T_J - T) / P
Where:
T_J = chip junction temperature
T = ambient temperature
P = device power dissipation
Factors that can greatly influence the measurement and calculation of θ_JA include:
1. Whether the device is board mounted
2. Trace size, composition, thickness, and geometry
3. Orientation of the device (horizontal or vertical)
4. Volume of the ambient air surrounding the device under test and airflow
5. Whether other surfaces are in close proximity to the device being tested
Due to the charge profile of Li-ion batteries, the maximum power dissipation is typically seen at the beginning of
the charge cycle when the battery voltage is at its lowest. Typically, after fast charge begins, the pack voltage
increases to ~3.4 V within the first 2 minutes. The thermal time constant of the assembly typically takes a few
minutes to heat up so when doing maximum power dissipation calculations, 3.4 V is a good minimum voltage to
use. This is easy to verify, with the system and a fully discharged battery, by plotting temperature on the bottom
of the PCB under the IC (pad must have multiple vias), the charge current and the battery voltage as a function
of time. The fast-charge current starts to taper off if the part goes into thermal regulation.
The device power dissipation, P, is a function of the charge rate and the voltage drop across the internal
PowerFET. It can be calculated from the following equation when a battery pack is being charged :
P = [V_(IN) – V_(OUT)] × I_(OUT) + [V_(OUT) – V_(BAT)] × I_(BAT)
The thermal loop feature reduces the charge current to limit excessive IC junction temperature. It is
recommended that the design not run in thermal regulation for typical operating conditions (nominal input voltage
and nominal ambient temperatures) and use the feature for nontypical situations such as hot environments or
higher than normal input source voltage. With that said, the IC still performs as described, if the thermal loop is
always active.
Copyright © 2008, Texas Instruments Incorporated
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Product Folder Link(s): bq24230 bq24232