THS8134 Datasheet, PDF (22/24 Pages) Texas Instruments – TRIPLE 8-BIT, 80 MSPS VIDEO D/A CONVERTER WITH TRI-LEVEL SYNC GENERATION

THS8134, THS8134A, THS8134B
TRIPLE 8-BIT, 80 MSPS VIDEO D/A CONVERTER
WITH TRI-LEVEL SYNC GENERATION
SLVS205D – MAY 1999 – REVISED MARCH 2000
APPLICATION INFORMATION
designing with PowerPAD™ (continued)
For the THS8134, this thermal land should be grounded to the low impedance ground plane of the device. This
improves not only thermal performance but also the electrical grounding of the device. It is also recommended
that the device ground terminal landing pads be connected directly to the grounded thermal land. The land size
should be as large as possible without shorting device signal terminals. The thermal land may be soldered to
the exposed PowerPAD using standard reflow soldering techniques.
While the thermal land may be electrically floated and configured to remove heat to an external heat sink, it is
recommended that the thermal land be connected to the low impedance ground plane for the device.
Table 11 lists a comparison for thermal resistances between the PowerPAD package (48-PHP) used for this
device and a regular 48-pin TQFP package (48-PFB).
Table 11. Junction-Ambient and Junction-Case Thermal Resistances
48PHP PowerPAD vs 48PFB
REGULAR TQFP
θ_JA (°C/W) 48PHP
θ_JC (°C/W) 48PHP
θ_JA (°C/W) 48PFB
θ_JC (°C/W) 48PFB
AIRFLOW IN lfm
0
150 250 500
29.1 23.1 21.6 19.9
1.14
97.5 78.3 71.6 63.5
19.6
22
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