TLC2264 Datasheet, PDF (2/59 Pages) Texas Instruments – Advanced LinCMOS RAIL-TO-RAIL OPERATIONAL AMPLIFIERS

TLC226x, TLC226xA
Advanced LinCMOS RAIL-TO-RAIL
OPERATIONAL AMPLIFIERS
SLOS177D – FEBRUARY 1997 – REVISED MARCH 2001
TLC2262 AVAILABLE OPTIONS
TA
0°C to 70°C
VIOmax
AT 25°C
2.5 mV
SMALL
OUTLINE
(D)
TLC2262CD
CHIP
CARRIER
(FK)
—
PACKAGED DEVICES
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
—
TLC2262CP
TSSOP
(PW)
TLC2262CPW
CERAMIC
FLATPACK
(U)
—
– 40°C to 125°C
950 µV TLC2262AID
2.5 mV TLC2262ID
—
—
—
TLC2262AIP TLC2262AIPW
—
—
TLC2262IP
—
—
– 40°C to 125°C
950 µV TLC2262AQD
2.5 mV TLC2262QD
—
—
—
—
—
—
—
—
—
—
– 55°C to 125°C
950 µV
2.5 mV
—
TLC2262AMFK TLC2262AMJG
—
—
TLC2262MFK TLC2262MJG
—
—
TLC2262AMU
—
TLC2262MU
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2262CDR). The PW package is available only left-end taped
and reeled. Chips are tested at 25°C.
TLC2264 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25°C
SMALL
OUTLINE
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(J)
PLASTIC
DIP
(N)
TSSOP
(PW)
CERAMIC
FLATPACK
(W)
0°C to 70°C
2.5 mV TLC2264CD
—
—
TLC2264CN TLC2264CPW
—
– 40°C to 125°C
950 µV TLC2264AID
2.5 mV TLC2264ID
—
—
—
TLC2264AIN TLC2264AIPW
—
—
TLC2264IN
—
—
– 40°C to 125°C
950 µV TLC2264AQD
2.5 mV TLC2264QD
—
—
—
—
—
—
—
—
—
—
– 55°C to 125°C
950 µV
2.5 mV
—
TLC2264AMFK TLC2264AMJ
—
—
TLC2264MFK TLC2264MJ
—
—
TLC2264AMW
—
TLC2264MW
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2264CDR). The PW package is available only left-end taped
and reeled. Chips are tested at 25°C.
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