THS7530 Datasheet, PDF (2/19 Pages) Texas Instruments – HIGH-SPEED, FULLY DIFFERENTIAL, CONTINUOUSLY VARIABLE GAIN AMPLIFIER

THS7530
SLOS405A DECEMBER 2002– REVISED APRIL 2003
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to
damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGING/ORDERING INFORMATION
PRODUCT
PACKAGE
PACKAGE
DESIGNATOR
SYMBOL
THS7530 TSSOP PowerPAD
PWP-14
THS7530
TEMPERATURE
RANGE, TA
–40°C to 85°C
ORDERING
NUMBER
THS7530PWP
THS7530PWPR
TRANSPORT
MEDIA
Tube
Tape and reel
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
Supply voltage, VS+ – Vs_–
Input voltage, VI
Output current, IO ⁽²⁾
Differential input voltage, VID
Continuous power dissipation
Maximum junction temperature, TJ
Maximum junction temperature for long term stability, TJ
Operating free-air temperature range, TA
Storage temperature range, Tstg
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
HBM
ESD
CDM
MM
THS7530
5.5 V
±VS
65 mA
±4 V
See Dissipation Rating Table
150°C
125°C
–40°C to 85°C
–65°C to 150°C
300°C
3000 V
1500 V
200 V
(1) _{Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and}
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) _{The THS7530 incorporates a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipative}
plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could permanently damage
the device. See TI technical brief SLMA002 and SLMA004 for more information about utilizing the PowerPAD thermally enhanced package.
RECOMMENDED OPERATING CONDITIONS
Supply voltage, [VS_– to VS+]
Operating free–air temperature, TA
Input common mode voltage
Output common mode voltage
TEST CONDITIONS
[VS_– to VS+] = 5 V
[VS_– to VS+] = 5 V
MIN TYP MAX UNIT
4.5
5 5.5 V
–40
85 °C
2.5
V
2.5
V
PACKAGE THERMAL DATA
PACKAGE
PCB
14PWP
See Layout Considerations in the application
section of this data sheet.
Θ_JA
( C/W)
37.5
Θ_JC
( C/W)
2.07
TA = 25°C
POWER RATING
3W
PowerPAD is a trademark of Texas Instruments.
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