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THS4281 Datasheet, PDF (2/31 Pages) Texas Instruments – VERY LOW-POWER, HIGH-SPEED, RAIL-TO-RAIL INPUT AND OUTPUT VOLTAGE-FEEDBACK OPERATIONAL AMPLIFIER
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THS4281
SLOS432 – APRIL 2004
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device
placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
Supply voltage, VS- to VS+
Input voltage, VI
Differential input voltage, VID
Output current, IO
Continuous power dissipation
Maximum junction temperature, any condition, (2) TJ
Maximum junction temperature, continuous operation, long term reliability(2) TJ
Storage temperature range, Tstg
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
HBM
ESD ratings CDM
MM
UNIT
16.5 V
±VS± 0.5 V
±2 V
±100 mA
See Dissipation Rating Table
150°C
125°C
-65°C to 150°C
300°C
3500 V
1500 V
100 V
(1) The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may
cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.
(2) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may
result in reduced reliability and/or lifetime of the device. recommended operating conditions.
RECOMMENDED OPERATING CONDITIONS
Supply voltage, (VS+ and VS -)
Dual supply
Single supply
MIN
±1.35
2.7
MAX
±8.25
16.5
UNIT
V
DISSIPATION RATINGS TABLE PER PACKAGE
PACKAGE
θJC
(°C/W)
θJA (1)
(°C/W)
DBV (5)
D (8)
DGK (8)
55
255.4
38.3
97.5
71.5
180.8
POWER RATING(2)
TA < 25°C
391 mW
TA = 85°C
156 mW
1.02 W
410 mW
553 mW
221 mW
(1) This data was taken using the JEDEC standard High-K test PCB.
(2) Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase.
Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance and long
term reliability.
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