THS4032IDR Datasheet, PDF (2/47 Pages) Texas Instruments – 100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS

THS4031
THS4032
SLOS224G – JULY 1999 – REVISED MARCH 2010
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
VOLTAGE NOISE AND CURRENT NOISE
vs
FREQUENCY
20
V_CC = ± 15 V AND ± 5 V
T_A = 25°C
10
V_n
I_n
1
10
100
1k
10 k
100 k
f − Frequency − Hz
T_A
0°C to 70°C
–40°C to 85°C
–55°C to 125°C
NUMBER OF
CHANNELS
1
2
1
2
1
PLASTIC
SMALL
OUTLINE⁽²⁾ (D)
THS4031CD
THS4032CD
THS4031ID
THS4032ID
—
AVAILABLE OPTIONS⁽¹⁾
PACKAGED DEVICES
PLASTIC MSOP⁽²⁾(DGN)⁽³⁾
DEVICE
SYMBOL
CERAMIC DIP
(JG)
THS4031CDGN
THS4032CDGN
THS4031IDGN
THS4032IDGN
—
TIACM
TIABD
TIACN
TIABG
—
—
—
—
—
THS4031MJG
EVALUATION
CHIP CARRIER _MODULE
(FK)
—
—
—
—
THS4031MFK
THS4031EVM
THS4032EVM
—
—
—
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) The D and DGN packages are available taped and reeled. Add an R suffix to the device type (that is, THS4031CDGNR).
(3) The PowerPAD™ on the underside of the DGN package is electrically isolated from all other pins and active circuitry. Connection to the
PCB ground plane is recommended, although not required, as this copper plane is typically the largest copper plane on the PCB.
2
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