THS3201 Datasheet, PDF (2/29 Pages) Texas Instruments – 1.8-GHz, LOW DISTORTION, CURRENT FEEDBACK AMPLIFIER

THS3201
SLOS416A − JUNE 2003 − REVISED JANUARY 2004
www.ti.com
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
UNIT
Supply voltage, V_S
Input voltage, V_I
Output current, I_O ⁽²⁾
Differential input voltage, V_ID
Continuous power dissipation
16.5 V
±V_S
175 mA
±3 V
See Dissipation Rating Table
Maximum junction temperature, T_J ⁽³⁾
Maximum junction temperature, continuous
operation, long term reliability T_J ⁽⁴⁾
Operating free-air temperature range, T_A
Storage temperature range, T_stg
Lead temperature
1,6 mm (1/16 inch) from case for 10 seconds
150°C
125°C
−40°C to 85°C
−65°C to 150°C
300°C
HBM
3000 V
ESD ratings:
CDM
1500 V
MM
100 V
(1) _{Stresses above these ratings may cause permanent damage.}
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not implied.
(2) _{The THS3201 may incorporate a PowerPAD on the underside}
of the chip. This acts as a heat sink and must be connected to a
thermally dissipative plane for proper power dissipation. Failure
to do so may result in exceeding the maximum junction
temperature which could permanently damage the device. See TI
technical briefs SLMA002 and SLMA004 for more information
about utilizing the PowerPAD thermally enhanced package.
(3) _{The absolute maximum temperature under any condition is}
limited by the constraints of the silicon process.
(4) _{The maximum junction temperature for continuous operation is}
limited by package constraints. Operation above this temperature
may result in reduced reliability and/or lifetime of the device.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PACKAGE DISSIPATION RATINGS
PACKAGE
DBV (5)
θ_JC θ_JA⁽¹⁾
(°C/W) (°C/W)
55 255.4
POWER RATING⁽²⁾
(TJ = 125°C)
TA ≤ 25°C TA = 85°C
391 mW 156 mW
D (8)
38.3 97.5
1.02 W
410 mW
DGN (8)
4.7
58.4
1.71 W
685 mW
DGK (8 pin)
54.2 260 385 mW 154 mW
(1) _{This data was taken using the JEDEC standard High-K test PCB.}
(2) _{Power rating is determined with a junction temperature of 125°C.}
This is the point where distortion starts to substantially increase.
Thermal management of the final PCB should strive to keep the
junction temperature at or below 125°C for best performance and
long term reliability.
RECOMMENDED OPERATING CONDITIONS
MIN MAX UNIT
Supply voltage
Dual supply ±3.3 ±7.5
V
Single supply 6.6 15
Operating free-air temperature, T_A
−40 85 °C
PACKAGE/ORDERING INFORMATION
TEMPERATURE
PLASTIC SMALL
OUTLINE
(D)(1)
SOT-23(2)
(DBV)
PACKAGED DEVICES
PLASTIC MSOP(1)
POWERPAD
SYM
(DGN)
SYM
PLASTIC MSOP(1)
(DGK)
SYM
−40°C to 85°C
THS3201D
THS3201DR
THS3201DBVT
THS3201DBVR
BEO
THS3201DGN
THS3201DGNR
BEN
THS3201DGK
THS3201DGKR
(1) _{Available in tape and reel. The R suffix standard quantity is 2500 (e.g. THS3201DGNR).}
(2) _{Available in tape and reel. The R suffix standard quantity is 3000. The T suffix standard quantity is 250 (e.g. THS3201DBVT).}
BGP
PIN ASSIGNMENTS
TOP VIEW
SOT−23
TOP VIEW
D, DGN, DGK
VOUT
1
5
VS+
VS−
2
IN+
3
4
IN −
NOTE: If a PowerPAD is used, it is electrically isolated from the active circuitry.
NC 1
8
NC
V_{IN −}
2
7
V_S+
V_{IN +}
3
6
V_{OUT −}
V_S−
4
5
NC
NC = No Internal Connection
2