THS3201 Datasheet, PDF (19/29 Pages) Texas Instruments – 1.8-GHz, LOW DISTORTION, CURRENT FEEDBACK AMPLIFIER

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PowerPAD DESIGN CONSIDERATIONS
The THS3201 is available in a thermally-enhanced
PowerPAD family of packages. These packages are
constructed using a downset leadframe upon which the die
is mounted [see Figure 61(a) and Figure 61(b)]. This
arrangement results in the lead frame being exposed as a
thermal pad on the underside of the package [see
Figure 61(c)]. Because this thermal pad has direct thermal
contact with the die, excellent thermal performance can be
achieved by providing a good thermal path away from the
thermal pad.
The PowerPAD package allows for both assembly and
thermal management in one manufacturing operation.
During the surface-mount solder operation (when the
leads are being soldered), the thermal pad can also be
soldered to a copper area underneath the package.
Through the use of thermal paths within this copper area,
heat can be conducted away from the package into either
a ground plane or other heat dissipating device.
The PowerPAD package represents a breakthrough in
combining the small area and ease of assembly of surface
mount with the, heretofore, awkward mechanical methods
of heatsinking.
DIE
Side View (a)
DIE
End View (b)
Thermal
Pad
Bottom View (c)
Figure 61. Views of Thermally Enhanced Package
THS3201
SLOS416A − JUNE 2003 − REVISED JANUARY 2004
Although there are many ways to properly heatsink the
PowerPAD package, the following steps illustrate the
recommended approach.
Pin 1
0.205
0.060
0.013
0.017
0.030
0.075
0.025 0.094
0.010
vias
0.035
Top View
0.040
Figure 62. DGN PowerPAD PCB Etch and Via
Pattern
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