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DAC8812 Datasheet, PDF (2/18 Pages) Texas Instruments – Dual, Serial Input 16-Bit Multiplying Digital-to-Analog Converter
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DAC8812
SBAS349A – AUGUST 2005 – REVISED DECEMBER 2005
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION(1)
PRODUCT
DAC8812C
DAC8812B
MINIMUM
RELATIVE
ACCURACY
(LSB)
±1
±2
DIFFERENTIAL
NONLINEARITY
(LSB)
SPECIFIED
TEMPERATURE
RANGE
±1
–40°C to +85°C
±1
–40°C to +85°C
PACKAGE-
LEAD
TSSOP-16
TSSOP-16
PACKAGE
DESIGNATOR
PW
PW
ORDERING
NUMBER
DAC8812ICPW
DAC8812ICPWR
DAC8812IBPW
DAC8812IBPWR
TRANSPORT
MEDIA,
QUANTITY
Tube, 90
Tape and Reel, 2500
Tube, 90
Tape and Reel, 2500
(1) For the most current specifications and package information, see the Package Option Addendum located at the end of this document, or
see the TI website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
VDD to GND
VREF to GND
Logic inputs and output to GND
V(IOUT) to GND
AGNDX to DGND
Input current to any pin except supplies
Package power dissipation
Thermal resistance, θJA
Maximum junction temperature (TJmax)
Operating temperature range
Storage temperature range
DAC8812
– 0.3 to +8
–18 to +18
– 0.3 to +8
– 0.3 to VDD +0.3
–0.3 to +0.3
±50
(TJmax – TA)/θJA
100
+150
– 40 to +85
– 65 to +150
UNIT
V
V
V
V
V
mA
W
°C/W
°C
°C
°C
(1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. This is a stress rating only;
functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum conditions for extended periods may affect device reliability.
2
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